Manuel d'utilisation / d'entretien du produit Intel Xeon W3550 du fabricant HP
Aller à la page of 71
Document Number: 321461-001 Intel® Xeon® Processor 3500 Series Thermal / Mechanical Design Guide March 2009.
2 Thermal and Mechanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRE SS OR IMPLIED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT .
Thermal and Mechanical Design Guide 3 Contents 1I n t r o d u c t i o n ......... ............. ............... ............ ............... ............... ............ ............... .... 7 1.1 References ........... ............ ............... ..
4 Thermal and Mechanical Design Guide 6.4.1 Extrusion ............... ............. ............ ............... ............. ............ ...............42 6.4.2 Clip ........ ............... ............. ............ ............... ............. .
Thermal and Mechanical Design Guide 5 B-6 Reference Design Heatsink Assembly (2 of 2) ........... ................. .............. ................. .. 57 B-7 Reference Fastener Sheet 1 of 4 . ............... ............... ............ .............
6 Thermal and Mechanical Design Guide Revision History § Revision Number Description Revision Date -001 • Initial release March 2009.
Thermal/Mechanical Design Guide 7 Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for the: • Intel® Xeon® Processor 3500 Series Unless specifically required for clarity , this document will use “processor ” in place of the specific product names.
Introduction 8 Thermal/Mechanical Design Guide 1.1 References Material and concepts av ailable in the following documents may be beneficial when reading this document.
Thermal/Mechanical Design Guide 9 Introduction § TDP Thermal Design Power: T hermal solution sh ould be designed to dissipate this tar get power level.
Introduction 10 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 11 LGA1366 Socket 2 LGA1366 Socket This chapter describes a surface mount, LG A (Land Grid Array) socket intended for Intel® Xeon® Processor 3500 Series.
LGA1366 Socket 12 Thermal/Mechanical Design Guide Figure 2-2. LGA1366 Socket C ontact Numbering (Top View of Socket) 31 29 27 25 23 21 19 17 15 13 11 9 7 5 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 BA.
Thermal/Mechanical Design Guide 13 LGA1366 Socket 2.1 Board Layout The land pattern for the LGA1366 socket is 40 m ils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round- off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.
LGA1366 Socket 14 Thermal/Mechanical Design Guide 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw , extra solder , adhesiv e, and so on) to attach the socket.
Thermal/Mechanical Design Guide 15 LGA1366 Socket 2.3.3 Contacts Base material for the contacts is high strength copper allo y . For the area o n socket contacts where processor lands will mate, there is a 0.381 μ m [15 μ inches] minimum gold plating over 1.
LGA1366 Socket 16 Thermal/Mechanical Design Guide 2.4 Package Installation / Removal As indicated in Figure 2-6 , access is provided to facilitate manual installation and removal of the package.
Thermal/Mechanical Design Guide 17 LGA1366 Socket 2.5 Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Ta b l e 4 - 4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
LGA1366 Socket 18 Thermal/Mechanical Design Guide 2.9 LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of th e sock et as non-critical to function (NCTF) for post environmental testing.
Thermal/Mechanical Design Guide 19 Independent Loading Mechanism (ILM ) 3 Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) pr ovides the force needed to se at the 1366-LGA land package onto the socket contacts. The ILM is physically separ ate from the socket body .
Independ ent Loading Mechan ism (ILM) 20 Thermal/Mechanical Design Guide 3.1.2 ILM Back Plate Design Overview The back plate for single processor workstation products consists of a flat steel back plate with threaded studs for ILM attach.
Thermal/Mechanical Design Guide 21 Independent Loading Mechanism (ILM ) . Figure 3-2. ILM Assembly Socket Bo dy with Back Plat e on board Socket Bo dy Reflowe d on boar d Step 1 Step 2 Socket Bo dy wi.
Independ ent Loading Mechan ism (ILM) 22 Thermal/Mechanical Design Guide As indicated in Figure 3-3 , soc ket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever .
Thermal/Mechanical Design Guide 23 LGA1366 Socket and ILM Electrica l, Mechanical, and Environmental Specifications 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechan ical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism.
LGA1366 Socket and ILM Electrical , Mechan ical, and Environmental Sp ecifications 24 Thermal/Mechanical Design Guide 4.4 Loading Specifications The socket will be tested against the conditions listed in Chapter 7 with heatsink and the ILM attached, under the loading conditions outlined in this chapter .
Thermal/Mechanical Design Guide 25 LGA1366 Socket and ILM Electrica l, Mechanical, and Environmental Specifications 4.6 Environmental Requirements Design, including materials, shall be consiste nt with the manufacture of units that meet the following environmental reference points.
LGA1366 Socket and ILM Electrical , Mechan ical, and Environmental Sp ecifications 26 Thermal/Mechanical Design Guide A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability .pd f . § Figure 4-1.
Thermal/Mechanical Design Guide 27 Sensor Based Thermal Specification Design Guidance 5 Sensor Based Thermal Specification Design Guidance The introduction of the sen sor based therma l specification presents opportunities for the system designer to optimize the acou stics and simplify thermal validation.
Sensor Based Thermal Specification Design Guidance 28 Thermal/Mechanical Design Guide 5.2 Sensor Based Thermal Specification The sensor based thermal specification consis ts of two parts. The first is a thermal profile that defines the maximum T TV T CASE as a function of T TV power dissipation.
Thermal/Mechanical Design Guide 29 Sensor Based Thermal Specification Design Guidance As in previous product specifications, a know ledge of the system boundary conditions is necessary to perform the heatsink validation. Section 5.3.1 will provide more detail on defining the boundary conditions.
Sensor Based Thermal Specification Design Guidance 30 Thermal/Mechanical Design Guide 5.3 Thermal Solution Design Process Thermal solution design guidance for this sp ecification is the same as with previous products. The initial design must take into account the target market and overall product requirements for the system.
Thermal/Mechanical Design Guide 31 Sensor Based Thermal Specification Design Guidance Note: If the assumed T AMBIENT is inappropriate for the intended system environment, the thermal solution performance ma y not be sufficient to meet the product requirements.
Sensor Based Thermal Specification Design Guidance 32 Thermal/Mechanical Design Guide 5.3.3 Thermal Solution Validation 5.3.3.1 Test for Compliance to the TTV Therm al Profile This step is the same as previously sugges ted for prior products.
Thermal/Mechanical Design Guide 33 Sensor Based Thermal Specification Design Guidance Note: This data is taken from the validation of the RCBF5 reference processor thermal solution. The Ψ CA vs. RPM data is available in Ta b l e 5 - 1 at the end of this chapter .
Sensor Based Thermal Specification Design Guidance 34 Thermal/Mechanical Design Guide 5.4.1 Fan Speed Contro l Algorithm without T AMBIENT Data In a system that does not provide the FSC algorithm with.
Thermal/Mechanical Design Guide 35 Sensor Based Thermal Specification Design Guidance 5.4.2 Fan Speed Contro l Algorithm with T AMBIENT Data In a system where the FSC algorithm has access to the T AMBIENT information and is capable of using the data the benefits of the D TS thermal specification become more striking.
Sensor Based Thermal Specification Design Guidance 36 Thermal/Mechanical Design Guide 5.5 System Validation System v alidation should focus on ensuring the fan speed control algorithm is responding appropriately to the DT S values and T AMBIENT data as well as any other device being monitored for thermal compliance.
Thermal/Mechanical Design Guide 37 Sensor Based Thermal Specification Design Guidance 5.6 Specification for Operation Where Digital Thermal Sensor Exceeds T CONTROL Ta b l e 5 - 1 is provided as reference for the deve lopment of thermal solutions and the fan speed control algorithm.
Sensor Based Thermal Specification Design Guidance 38 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 39 ATX Reference Thermal Solution 6 ATX Reference Thermal Solution Note: The reference thermal mechanical solution information shown in this document represents the current state of the data and may be subject to modification.
ATX Reference Thermal Solution 40 Thermal/Mechanical Design Guide 6.2 Heatsink Thermal Solution Assembly The reference thermal solution for the processo r is an active fan solution similar to the prior designs for the Intel® Pentium® 4 and Intel® Core™2 Duo processors.
Thermal/Mechanical Design Guide 41 ATX Reference Thermal Solution 6.3 Geometric Envelope for the Intel ® Reference ATX Thermal Mechanical Design Figure 6-2 shows a 3-D representation of the bo ard component keep out for the reference A TX thermal solution.
ATX Reference Thermal Solution 42 Thermal/Mechanical Design Guide 6.4 Reference Design Co mponents 6.4.1 Extrusion The aluminum extrusion is a 51 fin 102 mm di ameter bifurcated fin design. The over all height of the extrusion is 38 mm tall. T o facilitate reuse of the core design the center cylinder ID and wall thickness are the same as RCFH4.
Thermal/Mechanical Design Guide 43 ATX Reference Thermal Solution 6.4.2 Clip Structural design str ategy for the clip is to provide sufficient load for the Thermal Interface Material (TIM). The clip is formed from 1.6 mm carbon steel, th e same material as used in previous clip designs.
ATX Reference Thermal Solution 44 Thermal/Mechanical Design Guide 6.4.3 Core The core is the same forged design used in RCFH4. This allows the reuse of the fan attach and if desired the same extrusion as used in RCFH4.
Thermal/Mechanical Design Guide 45 ATX Reference Thermal Solution Figure 6-6. Clip Core and Extrusi on Assembly Figure 6-7. Cri tical Parameters for Interface to the Reference Cli p Core shoulder trap.
ATX Reference Thermal Solution 46 Thermal/Mechanical Design Guide 6.6 Heatsink Mass and Center of Gravity • T otal asse mbly mass ≤ 550 gm (grams), excluding clip and fasteners • T otal mass including clip and fasteners < 595 g • Assembly center of gravity ≤ 25.
Thermal/Mechanical Design Guide 47 Thermal Solution Quality and Reliability Requirements 7 Thermal Solution Quality and Reliability Requirements 7.1 Reference Heatsink Thermal Verification Each motherboard, heatsink and attach combination may v ary the mechanical loading of the component.
Thermal Solution Quality and Reliability Requirements 48 Thermal/Mechanical Design Guide 7.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface.
Thermal/Mechanical Design Guide 49 Component Suppliers A Component Suppliers Note: The part numbers listed below identifies the reference components. End-users are responsible for the verification o f the Intel enabled component offerings with the supplier .
Component Suppliers 50 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 51 Mechanical Drawings B Mechanical Drawings Ta b l e B - 1 lists the mechanical drawings included in this appendix. Table B-1.
Mechanical Drawings 52 Thermal/Mechanical Design Guide Figure B-1. Socket / Heatsink / IL M Keepout Zone Primary Side (Top) 8 7 6 5 4 3 2 H G F E D C B A 8 7 6 5 4 3 2 1 H G F E D C B A 4X NPTH LOCATION 0.1 RADIAL TRUE POSITION RELATIVE TO SOCKET CENTER.
Thermal/Mechanical Design Guide 53 Mechanical Drawings Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom ) H G F E D C B A H G F E D C B A 8 7 6 5 4 3 2 8 7 6 5 4 3 2 1 23.50 0.00 23.50 36.10 0.00 36.10 4X 10.00 4X 6.00 (14.00 ) (19.
Mechanical Drawings 54 Thermal/Mechanical Design Guide Figure B-3. Socket / Processor / IL M Keep out Zone Primary Side (Top).
Thermal/Mechanical Design Guide 55 Mechanical Drawings Figure B-4. Socket / Processor / ILM Keepout Zo ne Secondary Side (Bottom).
Mechanical Drawings 56 Thermal/Mechanical Design Guide Figure B-5. Reference Design Heatsink Assemb ly (1 o f 2).
Thermal/Mechanical Design Guide 57 Mechanical Drawings Figure B-6. Reference Design Heatsink Assembly (2 of 2).
Mechanical Drawings 58 Thermal/Mechanical Design Guide Figure B-7. Reference Fastener Sheet 1 of 4.
Thermal/Mechanical Design Guide 59 Mechanical Drawings Figure B-8. Reference Fastener Sheet 2 of 4.
Mechanical Drawings 60 Thermal/Mechanical Design Guide Figure B-9. Reference Fastener Sheet 3 of 4.
Thermal/Mechanical Design Guide 61 Mechanical Drawings Figure B-10. Referen ce Fastener Sheet 4 of 4.
Mechanical Drawings 62 Thermal/Mechanical Design Guide Figure B-11. Reference Cl ip - Sheet 1 of 2 8 7 6 5 4 3 2 H G F E D C B A 8 7 6 5 4 3 2 1 H G F E D C B A A A THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Thermal/Mechanical Design Guide 63 Mechanical Drawings § Figure B-12. Reference Clip - Sheet 2 of 2 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Mechanical Drawings 64 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 65 Socket Mechanical Drawings C Socket Mechanical Drawings Ta b l e C - 1 lists the mechanical drawings included in this appendix.
Socket Mechanical Drawings 66 Thermal/Mechanical Design Guide Figure C-1. Socket Mechanic al Drawing (Sheet 1 of 4).
Thermal/Mechanical Design Guide 67 Socket Mechanical Drawings Figure C-2. Socket Mechanic al Drawing (Sheet 2 of 4).
Socket Mechanical Drawings 68 Thermal/Mechanical Design Guide Figure C-3. Socket Mechanic al Drawing (Sheet 3 of 4).
Thermal/Mechanical Design Guide 69 Socket Mechanical Drawings § Figure C-4. Socket Mechanic al Drawing (Sheet 4 of 4).
Socket Mechanical Drawings 70 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 71 Processor Installation Tool D Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for av ailability: Billy Hsieh billy .
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté HP Intel Xeon W3550 c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du HP Intel Xeon W3550 - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation HP Intel Xeon W3550, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le HP Intel Xeon W3550 va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le HP Intel Xeon W3550, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du HP Intel Xeon W3550.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le HP Intel Xeon W3550. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei HP Intel Xeon W3550 ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
