Manuel d'utilisation / d'entretien du produit ML370 du fabricant HP (Hewlett-Packard)
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HP Pr oL i ant ML3 7 0 Gener ati o n 5 Se r v er Maint enance and S erv ice Gui de Part Number 404682-009 October 2008 (Ninth Edition).
© Copyright 2006, 2008 Hewlett- Packard Development Company, L.P. The information contained herein is subject to chan ge without no tice. The only warranties for HP products and services a re set forth in the express warranty statements accompanying such produc ts and services.
Contents 3 Con t en t s Customer se lf re pair ...................................................................................................................... 6 Parts only warr anty service ......................................................
Contents 4 Battery ........................................................................................................................ ........................... 68 Cablin g .......................................................................
Contents 5 Index .......................................................................................................................... ...........
Customer self repair 6 C u s tomer s elf r epair HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing def ective parts re placement.
Customer self repair 7 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 8 NOTA: alcuni componenti HP non sono progettati per la ri parazione da parte del cl iente. Pe r rispettare la garanzia, HP richiede che queste parti siano sostituite da un c entro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Ca talogo illustrato dei componenti.
Customer self repair 9 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Customer self repair 10 Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los c omponentes defectuosos deberán devolverse a HP.
Customer self repair 11 periode, gewoonlijk vijf (5) werkdagen, retourne ren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meeg eleverde verpakkingsmateriaal. Als u h et defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in reken ing brengen.
Customer self repair 12 Se r v iço de gar an ti a ap ena s par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rnece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Customer self repair 16.
Illustrated parts catalog 17 Illus tr ated par ts catalog Mechanical components.
Illustrated parts catalog 18 Item Description Assembly part number Spare part number Customer self repair (on page 6 ) 1 Access panel (top cover) 389059-001 409410-001 Mandatory 1 2 Front bezel (tower.
Illustrated parts catalog 19 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
Illustrated parts catalog 20.
Illustrated parts catalog 21 System components Item Description Assembly part number Spare part number Customer self repair (on page 6 ) System components 14 Hot-plug power supply, 1000- W 380622-001 403781-001 Mandatory 1 15 Hot-plug fan, 120-mm 384881-001 409421-001 Mandatory 1 16 3.
Illustrated parts catalog 22 Item Description Assembly part number Spare part number Customer self repair (on page 6 ) 17 Processor — — — a) Dual-Core, Intel® Xeon® Processor 5050 (3.00-GHz, 66 7-MHz FSB, 2x2- MB L2 cache)† 405176-004 40942 3-001 Optional 2 b) Dual-Core, Intel® Xeon® Processor 5060 (3.
Illustrated parts catalog 23 Item Description Assembly part number Spare part number Customer self repair (on page 6 ) p) Quad-Core, Intel® Xeon® Processor X5355 (2.66-GHz, 13 33-MHz FSB, 4x2-MB L2 cache)*† 432231-001 43836 3-001 Optional 2 q) Quad-Core, Intel® Xeon® Processor X5365 (3.
Illustrated parts catalog 24 Item Description Assembly part number Spare part number Customer self repair (on page 6 ) 21 PPM 399854-001 40774 8-001 Mandatory 1 22 Power supply backpla ne 379125-001 3.
Illustrated parts catalog 25 Item Description Assembly part number Spare part number Customer self repair (on page 6 ) 36 Diskette drive cable* 271946-008 431243-001 Mandatory 1 37 Second parallel/ser.
Illustrated parts catalog 26 1 Mandatory: Obligatoire—Pièces pour le squelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Illustrated parts catalog 27 3 No: Nenhuma—Algumas peças da HP não são projetadas pa ra o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peç a. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.
Removal and replacement procedures 28 R emo v al and r eplacement pr ocedur es Required tools You need the following item s for some procedures: • T-10/T-15 Torx screwdriver (included with the serve.
Removal and replacement procedures 29 This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric sh ock, fire, or damage to the equipment, do not plug telephone or telecommunicat ions connectors into this receptacle.
Removal and replacement procedures 30 Preparation procedures To access some components and perf orm certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 30 ).
Removal and replacement procedures 31 2. After performing the installation or maintenance proc edure, sl ide the server into the rack by press ing the server rail-release latch es.
Removal and replacement procedures 32 3. Extend the server from the rack. Rever se the server installation steps in the docume ntation that ships with the rack-mounting option. 4. Press the server rail-relea se latches and remove the server from the r ack.
Removal and replacement procedures 33 2. Lift up the front bezel and remove it from the chassis. To replace the component, reverse the r emoval procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Removal and replacement procedures 34 3. Loosen the two thumbscrews that secu re the rack bezel to the chassis. 4. Remove the rack bezel. To replace the component, reverse the r emoval procedure. Feet NOTE: This procedure applies to tower servers only.
Removal and replacement procedures 35 3. Remove the feet. To replace the component, slide it back i nto the locking slot. Be sure that the foot clicks securely into the chassis. Repeat with the remaining feet, as necessary. Tower configuration panels To remove the component: 1.
Removal and replacement procedures 36 Rack rails NOTE: This procedure applies to rack servers only. To remove the component: 1. Power down the server (on page 31 ). 2. Remove the server from the rack (on pag e 31 ). 3. Pull the rack rail latch. 4. Slide the rail to the front of the server to r elease the rail.
Removal and replacement procedures 37 Remove the component as indicated. To replace the component, reverse the r emoval procedure. Hot-plug power supply WARNING: To reduce the risk of electr ic shock, do not disassemble the power supply or attempt to repair it.
Removal and replacement procedures 38 3. Remove the power supply. CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 39 To replace the component, reverse the r emoval procedure. Hard drive To remove the component: CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 40 NOTE: The center wall is removed fo r illustration purposes only. 7. Disconnect the SAS-SATA cabl es from the SAS backplane.
Removal and replacement procedures 41 9. Remove the SAS cage. To replace the component, reverse the r emoval procedure. System fans The server supports redundant hot-plug fans to provide pr oper airflow to the system if a primary fan fails. In the standard, non-redundant, configurat ion, fans 1, 2, and 3 cool the server.
Removal and replacement procedures 42 • In the operating system: o The Health Driver performs an orderly shutdown if it detects a cautionary temperature level. If the server detects a critical temperature level before the orderly shutdown occur s, the server performs an immediate shutdown.
Removal and replacement procedures 43 5. Remove the expansion slot cover. Retain the slot cover for future use. CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all PCI slots have either an expansion slo t cover or an expansion board installed.
Removal and replacement procedures 44 5. Release the retainer clip. 6. Press the slot release lev er and swing the slot release lever upward. 7. Remove the expansion board. CAUTION: Make a note of board locati ons. Be sure to install replacements in the same slots.
Removal and replacement procedures 45 4. Remove the expansion slot cover (" Expansion slot cov er " on page 42 ). 5. Remove any expansion board installed in the slot (" Expansion board " on page 43 ). 6. From the rear of the chassis, push up on the lever locking tab.
Removal and replacement procedures 46 4. Remove the processor air ba ffle. To replace the component, reverse the r emoval procedure. Center wall To remove the component: 1.
Removal and replacement procedures 47 7. Remove the center wall. To replace the component, reverse the r emoval procedure. Media blanks To remove the component: 1. Power down the server (on page 31 ). 2. Open or remove the tower bezel (" Front bezel " on page 32 ).
Removal and replacement procedures 48 NOTE: HP recommends that you remove all media blanks to facilitate drive installation. Retain the blanks for future use. To replace the component, reverse the r emoval procedure. Half-height or full-height media devices To remove the component: 1.
Removal and replacement procedures 49 o Unlock and remove the bezel (" Front bezel " on page 32 ). o Extend the server from the rack (on page 30 ). 3. Remove the access panel (" Access panel " on page 33 ). 4. Press the HP Systems Insig ht Display ejector butto n to extend the HP Systems Insight Display.
Removal and replacement procedures 50 For maximum performance, HP recommends that both memory boards be popula ted with the same total amount of memory to support 4x1 interl eaving across both memory branches.
Removal and replacement procedures 51 2. Do one of the following: o Open or remove the tower bezel, as needed (" Front bezel " on page 32 ). o Extend the server from the rack (on page 30 ). 3. Remove the access panel (" Access panel " on page 33 ).
Removal and replacement procedures 52 IMPORTANT: Processor socket 1 must always be popula ted. If processor socket 1 is empty, the server does not power up. To remove the component: 1. Power down the server (on page 31 ). 2. Do one of the following: o Unlock and remove the bezel (" Front bezel " on page 32 ).
Removal and replacement procedures 53 8. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor r emains inside the processor installation tool. 1. If the processor has separated from the in stallation tool, carefully re-insert th e processor in the tool.
Removal and replacement procedures 54 3. Press down firmly until the processor in stallation tool clicks and separates from the processor, and then remove the processor installation tool.
Removal and replacement procedures 55 4. Close the processor retaining latch and th e processor socket retaini ng bracket. 5. Clean the old thermal grease fr om the heatsink with the alcohol swab .
Removal and replacement procedures 56 8. Close the heatsink retaining latches. 9. Install the processor air baffle. 10. Install the access panel. 11. Do one of the following: o Install and lock the bezel. o Slide the server back into the rack. 12. Power up the server.
Removal and replacement procedures 57 6. Remove the heats ink. To replace the heatsink: 1. Use the alcohol swab to remove all the existing th ermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply all the grease to the top of the processor in one of the foll owing patterns to ensure ev en distribution.
Removal and replacement procedures 58 4. Close the heatsink retaining latches. 5. Install the processor air baffle. 6. Install the access panel. 7. Do one of the following: o Install and lock the bezel. o Slide the server back into the rack. 8. Power up the server.
Removal and replacement procedures 59 5. Remove the PPM. NOTE: The appearance of compatible PPMs may vary. To replace the component, reverse the r emoval procedure. CAUTION: Only install a PPM if the processor is installed. Both the PPM and the processor must be installed together, othe rwise the system does not boot.
Removal and replacement procedures 60 8. Disconnect the signal cable from the power supply backplane. 9. Disconnect all cables from the system board, as necessary, to access the power supply backplane. 10. Remove the power supply backplane. To replace the component, reverse the r emoval procedure.
Removal and replacement procedures 61 o Extend the server from the rack (on page 30 ). 3. Remove the access panel (" Access panel " on page 33 ). 4. Remove all expansion boards (" Expansion board " on page 43 ). 5. Remove the processor air ba ffle (" Processor air baffle " on page 45 ).
Removal and replacement procedures 62 BBWC battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
Removal and replacement procedures 63 5. Remove the battery pack. To replace the component, reverse the r emoval procedure. System board IMPORTANT: If replacing the system board or clearing NVRAM, you mu st re-enter the server serial number through RBSU.
Removal and replacement procedures 64 11. Open the processor retaining latch and the processor socket retaining bracket. 12. Using your fingers, remove the processor from the failed system boar d. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts.
Removal and replacement procedures 65 15. Lift the system board out of the chassis and ti lt it to one side to clear the cable guide. To replace the system board: 1. Install the spare system board in the serv er before installing the processor. 2. Prepare the processor socket on the spare syst em board: a.
Removal and replacement procedures 66 b. Remove the processor socket protective cover. 3. Install the processor socket cove r onto the processo r socket of the fa iled system board. The cover protects the socket during shipping when the failed board is returned.
Removal and replacement procedures 67 5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evapo rate before continuing.
Removal and replacement procedures 68 After you replace the system board, you must re-ent er the server serial number and the product ID. 1. During the server startup se quence, press the F9 key to access RBS U. 2. Select the System Options menu. 3. Select Serial Number .
Removal and replacement procedures 69 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery , reconfigure t he system through RBSU. To replace the component, reverse the r emoval procedure.
Cabling 70 C abling Cabling overview This section provides g uidelines that help you ma ke informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website ( http://www.
Cabling 71 • SAS power cabling.
Cabling 72 CD-ROM drive cabling Video cabling.
Cabling 73 Parallel/serial port cabling BBWC option cabling.
Cabling 74 Internal USB connector Storage device cabling guidelines CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnec ted from the grounded (earthed) AC outlet before installing devi ces.
Diagnostic tools 75 Diagno s ti c tools Troubleshooting resources The HP ProLiant Servers Troubleshoot ing Guide provides proced ures for resolving common problems and comprehensive courses of action .
Diagnostic tools 76 Integrated Management Log The IML records hundreds of events and s tores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
Diagnostic tools 77 • Deleting a logical drive config uration If you do not use the utility, ORC A wi ll default to the standard configuration. For more information regarding array co ntroller config uration, refer to the controller user guide.
Diagnostic tools 78 IMPORTANT: This utility supports operating system s that may not be supported by the server. For operating systems supp orted by the server, see the HP website ( http://www.
Diagnostic tools 79 HP Insight Diagnostics HP Insight Diagnostics is a proactive serv er manage ment tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to a ssist IT administrators who verify server installations, troubles hoot pr oblems, and perform repair validation.
Server component identification 80 Serv er compone nt i dentif i cati on Front panel components • Rack model Item Description 1 Hard drive bays 9-16 (opti onal drive cage) 2 USB connectors 3 HP Syst.
Server component identification 81 • Tower model Item Description 1 Media bay spac er 2 DVD/CD-ROM drive 3 Removable media bays 4 Hard drive bays 1-8 5 Hard drive bays 9-16 (opti onal drive cage) 6 .
Server component identification 82 Item Description Status 1 UID button — 2 UID LED Blue = Activated Flashing blue = System is being managed remotely Off = Deactivated 3 Internal system health LED G.
Server component identification 83 Item Description 1 Keyboard connector 2 Mouse connector 3 USB connectors 4 iLO 2 management connector 5 Video connector 6 Serial connector 7 NIC 2 connector 8 PCI ex.
Server component identification 84 Item Description Status 5 NIC 2 link LED Green = Linked to network Off = No network connection 6 NIC 1 link LED Green = Linked to network Off = No network connection.
Server component identification 85 Item Description 12 Memory board connector 1 13 Memory board connector 2 14 PPM 1 15 Processor 1 16 Power connector 17 Fan control/HP Systems Insight Display connect.
Server component identification 86 Internal system health LED combinations When the internal system health LED on the front panel (" Front panel LEDs and buttons " on page 81 ) illuminates either amber or red, the serve r is experien cing a health event.
Server component identification 87 SAS and SATA device numbers The server supports a combination of up to 16 SAS an d SATA hard drives in two hard drive cages. HP recommends populating hard drive bays starting with the lowest SAS or SATA device number.
Server component identification 88 Item Description Status 2 Online/activity LED Green = Drive activity Flashing green = High activity on the drive or drive is being conf igured as part of an array Of.
Server component identification 89 FBDIMM slots The server supports two memory boards, each containi ng eight slots with paired banks identified by the letters A through D.
Server component identification 90 Power supply backplane LED If the power supply backplane LED is illumina ted, the power supply bac kplane has failed.
Server component identification 91 Systems Insight Display LEDs To view a quick reference for compon ent identificati on and status, access the Systems Insight Di splay.
Server component identification 92 Item Description Status 10 PPM 2 LED Amber = Failure Off = Normal 11 Hot-plug fan LEDs Amber = Fa ilure or fan is not installed Off = Normal 12 Internal system healt.
Specifications 93 Sp e c i fica t ion s Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (- 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.
Specifications 94 Specification Value Rated input power 1500 W BTUs per hour 273 0 Power supply output Rated steady-state power 800 W (low line), 1000 W (hi gh line) Maximum peak power 100 0 W (low line), 1200 W ( high line) * 100 to 127 VA C is required for 10 A; 200 to 240 VAC is required for 6 .
Specifications 95 Specification Value Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low.
Specifications 96 Specification Value Startup time < 10 s Stop time < 5 s (s ingle); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.
Acronyms and abbreviations 97 A c r on y ms and a bbr e v iati ons ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache BIOS Basic Input/Output System DDR double data rate .
Acronyms and abbreviations 98 NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI Express Peripheral Component Interconnect Express PCI-X peripheral compo.
Acronyms and abbreviations 99 SIM Systems Insight Manager SNMP Simple Network Management Protocol UID unit identification USB universal serial bus.
Index 100 A AC power supply 83 access panel 33 air baffle 30, 45 ASR (Automatic Serve r Recovery) 75 Automatic Server Recovery (ASR) 75 Autorun menu 78 B battery 84 battery-backed write cache (BBWC) 7.
Index 101 LEDs, power supply 90 LEDs, SAS hard drive 87, 88 LEDs, SATA hard drive 87, 88 LEDs, Systems Insight Display 91 M management tools 75 mechanical components 17 media drive 48 media drive blan.
Index 102 USB connectors 80 utilities 75 utilities, deployment 77, 78 V video connector 80.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté HP (Hewlett-Packard) ML370 c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du HP (Hewlett-Packard) ML370 - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation HP (Hewlett-Packard) ML370, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le HP (Hewlett-Packard) ML370 va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le HP (Hewlett-Packard) ML370, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du HP (Hewlett-Packard) ML370.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le HP (Hewlett-Packard) ML370. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei HP (Hewlett-Packard) ML370 ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
