Manuel d'utilisation / d'entretien du produit MDS-SD1 du fabricant Sony
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– 1 – MICROFILM MDS-SD1 SPECIFICA TIONS SERVICE MANUAL MINIDISC DECK Model Name Using Similar Mechanism MDS-JE520 MD Mechanism T ype MDM-5A Base Unit T ype MBU-5A Optical Pick-up T ype KMS-260A/J1N AEP Model UK Model E Model US and foreign patents licensed from Dolby Laboratories Licensing Corporation.
– 2 – SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers which are displayed automatically when er rors occur, and erro r codes whic h sho w the error history in the test mode dur ing servicing.
– 3 – ITEMS OF ERROR HIST OR Y MODE ITEMS AND CONTENTS Selecting the T est Mode Displa y total rec total play retry err total err err history er refresh tm refresh Details of History No error Disc error . PT OC cannot be read (DISC ejected) Disc error .
– 4 – CA UTION Use of controls or adjustments or performance of procedures other than those specified herein ma y result in hazardous ra- diation exposure. Notes on chip component replacement • Ne ver reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat.
– 5 – T ABLE OF CONTENTS 1. SER VICING NO TE .......................................................... 6 2. GENERAL ........................................................................ 15 3. DISASSEMBL Y 3-1. Glass ASSY ......................
– 6 – SECTION 1 SER VICING NO TE JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa veform of the BD board.
– 7 – IOP DA T A RECORDING AND DISPLA Y WHEN PICKUP AND NON-V OLA TILE MEMOR Y (IC171 OF BD BO ARD) ARE REPLA CED The IOP value la beled on the pick-up can be recorded in the non-v olatile memory . By recording the value, it will eliminate the need to look at the value on the label of the optical pic k-up.
– 8 – • 0.9 mW power Specified v alue : 0.84 to 0.92 mW • 7.0 mW power Specified v alue : 6.8 to 7.2 mW lop (at 7mW) • Labeled on the optical pickup Iop value ± 10mA • Tr aver se wave f o.
– 9 – FORCED RESET The system microprocessor can be reset in the follo wing procedure. Use these procedure when the unit cannot be operated normally due to the ov errunning of the microprocessor, etc. Procedur e : Short-circuit jumper wire of JW40 and JW41 (RESET).
– 10 – CLEANING OF OBJECTIVE LENS OF OPTICAL PICKUP • When cleaning the objectiv e lens of the optical pickup, move the mechanism deck using the follo wing method. 1 If a disc is inside, eject it out. 2 Disconnect the power cord from the outlet, and set the non-conducted state.
– 11 – ATT A CHING THE GLASS ASSEMBL Y • Attach according to steps 1 to 4 . 1 1 2 (Bottom side) 3 Bracket (shaft) 4 Screw (PTP2.6x6) When fixing this par t, secure at the center to allow f or some play . Open and close the glass window sev eral times, and chec k that the par ts do not touch each other .
– 12 – SER VICING POSITION 1 Remove the four scre ws securing the upper cov er , and remove the upper co ver . 2 Undo the bound cables. 3 Remove the tw o screws A securing the rear panel. 4 Remove the four scre ws B securing the transformer . 5 Remove the scr ew C securing the MAIN board.
– 13 – RETR Y CA USE DISPLA Y MODE • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit.
– 14 – He xadecimal Bit Binar y Higher Bits Lower Bits 84218421 b7 b6 b5 b4 b3 b2 b1 b0 00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000 He xa- decimal Details 01 02 04 08 10 20 40 80 Emphasis OFF Monaural This is 2-bit display .
– 15 – Location of Parts and Contr ols 1 1/u (Po w er) b utton 2 MD disk compartment 3 § button 4 CLEAR button 5 ENTER/YES button 6 V OLUME knob 7 MENU/NO button 8 ±/) button SECTION 2 GENERAL F.
– 16 – SECTION 3 DISASSEMBL Y Note: Follo w the disassembly procedure in the numerical order given. 3-1. GLASS ASSY 3-2. FR ONT P ANEL 4 4 3 (Bottom side) 2 Bracket (shaft) 1 Screw (PTP2.
– 17 – 3-4. B ASE UNIT AND BD BO ARD 3-3. SLIDER (CAM) 1 Two screws (BTP2.6x6) 2 Bracket (Guide L) 3 Leaf spring 5 Bracket (Guide R) 6 Slider (Cam) 4 Two screws (BTP2.6x6) Set the shaft of Lev er (O/C) to be at the position in the figure. Set the shaft of Cam gear to be at the position in the figure.
– 18 – 3-5. SW BO ARD AND LO ADING MO T OR (M103) 5 Two screws (BTP2.6x6) 6 SW board 4 Loading motor (M103 ) 3 Two screws (PWH1.7x4) 1 Screw (PTPWH M2.
– 19 – SECTION 4 TEST MODE 4-1. PRECAUTIONS FOR USE OF TEST MODE • As loading related operations will be performed reg ar dless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
– 20 – 4-5. SELECTING THE TEST MODE There are 31 types of test modes as sho wn belo w . The groups can be switched by rotating the – ˜ + knob . After selecting the group to be used, press the ENTER/YES b utton. After setting a certain group, rotating the – ˜ + knob switches between these modes.
– 21 – “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” 4-5-1. Operating the Continuous Playback Mode 1. Entering the continuous playback mode 1 Set the disc in the unit. (Whichev er recordable discs or discs for playback only are av ailable.
– 22 – P SYNC LEVEL-SYNC O VER REPEA T 1 TRA CK DISC DA T E MONO When Off Contents Displa y When Lit During continuous playback (CL V : ON) T racking servo OFF CL V low speed mode ABCD adjustment .
– 23 – 5-1. PARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follo ws. The procedure changes according to the part replaced SECTION 5 ELECTRICAL ADJUSTMENTS • Abbre viat.
– 24 – 5-2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSINON T o check the emission of the laser diode during adjustments, nev er vie w directly from the top as this may lose your eye-sight.
– 25 – 5-6. CHECKS PRIOR TO REP AIRS These checks are performed before replacing parts according to “approximate specifications” to determine the faulty loca tions. For details, refer to “Checks Prior to P arts Replacement and Adjustments” (See page 8).
– 26 – 10. Observe the wa veform of the oscilloscope, and check that the specified v alue is satisfied. Do not rotate the – ˜ + knob . (T rav erse W av ef orm) 11. Press the ENTER/YES button display “EF MO CHECK” The disc stops rotating automatically .
– 27 – 5-7. INITIAL SETTING OF ADJUSTMENT VALUE Note: Mode which sets the adjustment results recorded in the non-vola tile memory to the initial setting value. Ho wev er the results of the temperature compensation offset adjustment will not change to the initial setting value.
– 28 – KMS 260A 27X40 B0825 N Iop = 82.5 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 ( Ω ) 7. Then, rotate the – ˜ + knob and display “LDPWR CHECK”. 8. Press the ENTER/YES b utton once and display “LD 0.9 mW $ ”. Check that the reading of the laser po wer meter become 0.
– 29 – 11. Rotate the – ˜ + knob until the wa veform of the oscillo- scope mov es closer to the specified v alue. In this adjustment, wa veform v aries at intervals of a pprox. 2%. Adjust the wa veform so that the specified v alue is satisfied as much as possible.
– 30 – 5-13. ERROR RA TE CHECK 5-13-1. CD Error Rate Chec k Checking Procedur e : 1. Load a check disc (MD) TD YS-1. 2. Rotate the – ˜ + knob and display “CPLA Y MODE”. 3. Press the ENTER/YES button twice and display “CPLA Y MID”. 4. The display changes to “C1 = AD = ”.
– 31 – NO TE: It is useful to use the jig. for checking the wav eform. (Refer to Servicing Note on page 6.) 5-15. ADJUSTING POINTS AND CONNECTING POINTS [BD BO ARD] (SIDE A) [BD BO ARD] (SIDE B) C.
– 32 – SECTION 6 DIA GRAMS 6-1. CIRCUIT BO ARDS LOCA TION MAIN board SW board P ANEL board P ANEL SW board ENCODER board BD board CONNECT OR boar d.
MDS-SD1 – 33 – – 34 – 6-2. BLOCK DIA GRAMS – BD SECTION – HR901 OVER WRITE HEAD HEAD DRIVE Q181,182 3 6 1 2 FILTER PCO FILI FILO CLTV PLL EFM, ACIRC, ENCODER/ DECODER RF AGC & EQ AGCI .
MDS-SD1 – 35 – – 36 – – MAIN SECTION – 1 27 73 72 17 16 18 12 19 4 6 2 26 8 14 13 24 15 80 79 75 78 82 81 35 37 36 58 63 66 53 51 59 57 74 60 54 65 67 88 56 55 77 87 69 22 12 1 49 100 19 4.
MDS-SD1 – 37 – – 38 – WA VEFORMS – BD (1/2) SECTION – – MAIN SECTION – THIS NO TE IS COMMON FOR PRINTED WIRING BO ARDS AND SCHEMA TIC DIA GRAMS. (In addition to this, the necessary note is printed in each b lock.) For schematic diagrams.
MDS-SD1 6-3. PRINTED WIRING BO ARD – BD SECTION – • See page 32 for Cir cuit Boards Location. – 39 – – 40 – D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC123 D-2 IC171 D-1 Q102 B-1 Q103 B-1 Q104 B-1 IC101 A-3 IC121 C-3 IC124 C-3 IC152 B-1 IC181 C-1 IC192 D-1 Q101 B-3 Q162 B-3 Q163 B-3 Q181 C-1 Q182 C-2 Ref .
MDS-SD1 – 41 – – 42 – 6-4. SCHEMA TIC DIA GRAM – BD (1/2) SECTION – • See page 38 f or W a veforms. • See page 61 f or IC Block Diagrams.
MDS-SD1 – 43 – – 44 – 6-5. SCHEMA TIC DIA GRAM – BD (2/2) SECTION – • See page 38 for W aveforms. • See page 39 for Printed Wiring Board.
MDS-SD1 – 45 – – 46 – 6-6. SCHEMA TIC DIA GRAM – MAIN (1/2) SECTION – • See page 38 f or W avef orms. • See page 49 for Printed Wiring Board.
MDS-SD1 – 47 – – 48 – 6-7. SCHEMA TIC DIA GRAM – MAIN (2/2) SECTION – • See page 38 for W aveforms. • See page 62 for IC Bloc k Diagrams.
MDS-SD1 – 49 – – 50 – • Semiconductor Location 6-8. PRINTED WIRING BO ARD – MAIN SECTION – • See page 32 for Cir cuit Boards Location. Ref.
MDS-SD1 – 51 – – 52 – 6-9. SCHEMA TIC DIA GRAM – P ANEL SECTION – • See page 38 for W avef orms. (Page 47) 470p DTC143TKA-T146 DTC144EKA-T146 DTC144EKA-T146.
MDS-SD1 – 53 – – 54 – D941 C-7 D942 C-6 D943 C-3 D944 C-3 D945 C-4 D946 C-5 IC901 B-5 Q921 B-3 Q941 C-7 Q942 C-6 6-10. PRINTED WIRING BOARD – P ANEL SECTION – • See page 32 for Cir cuit Boards Location. • Semiconductor Location Ref. No.
MDS-SD1 – 55 – – 56 – 6-11. SCHEMA TIC DIA GRAM – CONNECT OR SECTION – • See page 63 f or IC Block Diagrams. (Page 46).
MDS-SD1 – 57 – – 58 – 6-12. PRINTED WIRING BO ARD – CONNECTOR SECTION – • See page 32 for Cir cuit Boards Location. • Semiconductor Location Ref.
MDS-SD1 6-14. PRINTED WIRING BO ARD – BD SWITCH SECTION – • See page 32 f or Cir cuit Boards Location. 6-13. SCHEMA TIC DIA GRAM – BD SWITCH SECTION – – 59 – – 60 – (Page 45) (Page 45) 6-15. SCHEMA TIC DIA GRAM – ENCODER SECTION – 6-16.
– 61 – 6-17. IC BLOCK DIA GRAMS – BD Section – IC101 CXA2523AR –1 –2 + – IVR BB + – IVR AA + – IVR CC + – IVR DD + – IVR + – EE EE' EFB TESW PTGR 48 MORFO 47 MORFI 46 RFO .
– 62 – IC152 BH6511FS-E2 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 123456789 10 11 12 13 14 15 16 GND VG IN4R IN4F VM4 OUT4F PGND4 OUT4R VM34 OUT3R PGND3 OUT3F VM3 IN3F IN3R PSB CAPA– CAPA+ IN2R IN2F VM2 OUT2F PGND2 OUT2R VM12 OUT1R PGND1 OUT1F VM1 IN1F IN1R V DD CHARGE PUMP.
– 63 – – CONNECT OR Section – IC822 M62016FP-E1 IC774 P82B715TD .118 + – + – 3 4 5 6 2 8 7 1 VCC NC NC NC RESET GND CD INT INTERRUPT SIGNAL GENERATOR RESET SIGNAL GENERATOR COM R1 R2 R3 R4.
– 64 – 6-18. IC PIN FUNCTIONS • IC101 CXA2523AR (RF Amplifier) (BD Board) Pin No . 1 I I I-V con verted RF signal I input from the optical pick-up block detector 2 J I I-V con verted RF signal J input from the optical pick-up block detector 3 VC O Middle point voltage (+1.
– 65 – • IC701 M30610MC-A01FP (SYSTEM CONTR OL µ CON) (MAIN BO ARD) Pin No . Pin Name I/O Function 1 WMOUT O MD WM LINK data out 2 WMCLK I MD WM LINK clock in 3 LEVEL-L O LEVEL-L D A output (No.
– 66 – Pin No . Pin Name I/O Function 51 CHAK-IN I Detection signal from IN switch 52 HOME I Detection signal form HOME switch 53 P A CK-OUT I Detection signal from OUT switch 54 LDIN O Loading mo.
– 67 – SECTION 7 EXPLODED VIEWS 7-1. CASE AND B A CK P ANEL SECTION NOTE: • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded vie ws are not supplied.
– 68 – 7-2. FR ONT P ANEL SECTION Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 61 4-951-620-01 SCREW (2.6X8), +BVTP * 62 1-671-539-11 P ANEL SW BOARD 63 X-4950-998-1 B.
– 69 – 7-3. MECHANISM DECK SECTION (MDM-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 215 4-996-227-01 LEVER (HEAD) 216 4-996-229-01 SPRING (HEAD LEVER), TORSION 21.
– 70 – 7-4. B ASE UNIT SECTION (MBU-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 265 4-996-261-01 GEAR (SL-B) 266 4-996-264-01 SPRING (SHAFT), LEAF 267 4-996-265-01 SHAFT , MAIN 268 4-996-256-11 SL (BASE) 269 4-996-257-01 RACK (SL) 270 4-996-263-01 SPRING (CL V), TORSION 271 4-988-560-01 SCREW (+P 1.
– 71 – • SEMICONDUCTORS In each case, u: µ , for example: uA...: µ A..., uP A...: µ P A..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD.
– 72 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD CONNECT OR L122 1-414-813-11 FERRITE 0uH L151 1-412-029-11 INDUCTOR CHIP 10uH L152 1-412-029-11 INDUCTOR CHIP 10.
– 73 – ENCODER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C792 1-163-121-00 CERAMIC CHIP 150PF 5% 50V < CONNECTOR > * CN771 1-568-832-11 SOCKET , CONNECTOR 13P.
– 74 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN C503 1-163-038-91 CERAMIC CHIP 0.1uF 25V C504 1-163-121-00 CERAMIC CHIP 150PF 5% 50V C505 1-163-121-00 CERAMIC CHIP 150PF 5% 50V C506 1-163-038-91 CERAMIC CHIP 0.
– 75 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < COIL > L501 1-414-396-21 INDUCTOR 4.7uH < LINE FIL TER > LF801 1-424-485-11 FIL TER, LINE < TRANSI.
– 76 – The components identif ied by mark ! or dotted line with mark ! are critical for safety . Replace only with part number specified . Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark P ANEL SW * A-4724-619-A P ANEL BOARD, COMPLETE ********************* < CAP ACITOR > C901 1-163-038-91 CERAMIC CHIP 0.
– 77 – Ref. No. Part No. Description Remark ACCESSORIES & P ACKING MA TERIALS ******************************* 1-543-793-11 FIL TER, CLAMP (FERRITE CORE) 1-558-271-11 CORD, CONNECTION (AUDIO, 1.
– 78 – Sony Corporation Home A&V Products Compan y 9-922-970-11 98L0953-1 Printed in Japan © 1998. 12 Published by Quality Assurance Dept. (Shibaura) MDS-SD1.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté Sony MDS-SD1 c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du Sony MDS-SD1 - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation Sony MDS-SD1, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le Sony MDS-SD1 va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le Sony MDS-SD1, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du Sony MDS-SD1.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le Sony MDS-SD1. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei Sony MDS-SD1 ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
