Manuel d'utilisation / d'entretien du produit nx6130 du fabricant HP (Hewlett-Packard)
Aller à la page of 199
Main tenan ce and Ser vice Gu id e HP C ompaq nx613 0 No teboo k P C Doc ument P art Number: 3 9 6 3 2 6 -001 June 200 5 This guide is a troubleshooting reference used for maintaining and servicing the notebook.
© Copyright 2005 He wlett-Packard De v elopment Company , L.P . Microsoft and W indo ws are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Maintenance and S ervi ce Guide iii Cont ents 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management .
i v Maintenance and S er vi ce Guide Cont ent s 4 Illustrated Parts Catalog 4.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 4–2 4.3 Miscellaneous Plastics Kit .
Cont ent s Maintenance and S ervi ce Guide v 6.7 External Memory Module . . . . . . . . . . . . . . . . . . . . 6–12 6.8 Mini PCI Communications Card . . . . . . . . . . . . . . . 6–14 6.9 Optical Drive . . . . . . . . . . . . . . . . . . . . . . .
v i Maintenance and S er vi ce Guide Cont ent s A Connector Pin Assignments B Power Cord Set Requirements C Screw Listing Index.
Maintenance and S ervi ce Guide 1–1 1 Product D esc ription The HP Compaq nx6130 Notebook PC of fers advanced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support.
1–2 Mainte nance and Service Gui de Product Description 1.1 F e a t u r e s ■ The follo wing processors are av ailable, varying by notebook model: ❏ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, 1.60-, or 1.30-GHz processor , ❏ Intel Celeron M 1.
Product Description Maintenance and S ervi ce Guide 1–3 ■ Integrated wireless support for Mini PCI IEEE 802.11b/g or 802.11a/b/g WLAN de vice ■ Support for one or two T ype II PC Card slots, wit.
1–4 Mainte nance and Service Gui de Product Description ■ Connectors: ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal Serial Bus (USB) v .
Product Description Maintenance and S ervi ce Guide 1–5 3. W ait approximately 5 minutes. 4. Replace the R TC battery and reassemble the notebook. 5. Connect A C power to the notebook. Do not reinsert an y battery packs at this time. 6. T urn on the notebook.
1–6 Mainte nance and Service Gui de Product Description 1 .4 Exter nal C ompon ents The external components on the front of the notebook are sho wn belo w and described in T able 1-1.
Product Description Maintenance and S ervi ce Guide 1–7 6 Batter y light ■ Amber : A battery pack is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A battery pack that is the only av ailable pow er source has reached a low-battery condition.
1–8 Mainte nance and Service Gui de Product Description The external components on the right side of the notebook are sho w n belo w and described in T able 1-2.
Product Description Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects optional headphones or powered stereo speakers . Also connects the audio function of an audio/v ideo de vice such as a television or VCR.
1–10 Maintenance and Serv ice Guide Product Description The external components on the left side of the notebook are sho w n belo w and described in T able 1-3. Left-Side Component s Ta b l e 1 - 3 Left-Side Components Item Component Function 1 USB por ts (2) Connect USB 1.
Product Description Maintenance and S ervi ce Guide 1–11 3 Exhaust vent Provides airflo w to cool inter nal components. Ä T o pre vent ov erheating, do not obstruct vents. Do not allow a hard surf ace, such as a printer, or a soft surf ace, such as pillows, thic k r ugs, or clothing, to bloc k airflow .
1–12 Maintenance and Serv ice Guide Product Description The external components on the rear panel of the notebook are sho w n belo w and described in T able 1-4.
Product Description Maintenance and S ervi ce Guide 1–13 T able 1-4 Rear P anel Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook. Ä Security solutions are designed to act as deterrents. These deterrents ma y not prev ent a product from being mishandled or stolen.
1–14 Maintenance and Serv ice Guide Product Description The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5.
Product Description Maintenance and S ervi ce Guide 1–15 T able 1-5 Standard K eyboar d Components Item Component Function 1 f1 to f12 ke ys (12) P erform system and application tasks. When combined with the fn key , s ever al ke ys and buttons perf or m additional tasks as hotke ys.
1–16 Maintenance and Serv ice Guide Product Description The notebook top components are sho wn below and described in T able 1-6. T op Components, P ar t 1 T able 1-6 T op Components, Part 1 Item Component Function 1 P ower/standb y button When the notebook is: ■ Off , press to tur n on the notebook.
Product Description Maintenance and S ervi ce Guide 1–17 2 Displa y lid switch ■ If the notebook is closed while on, tur ns off the displa y . ■ If the notebook is opened while in standby , turns on the notebook (resumes from standby). 3 Inf o Center button Launches Inf o Center.
1–18 Maintenance and Serv ice Guide Product Description The notebook top components are continued belo w and described in T able 1-7. T op Components, P ar t 2.
Product Description Maintenance and S ervi ce Guide 1–19 T able 1-7 T op Components, Part 2 Item Component Function 1 V olume mute button Mutes or restores system volume . 2 V olume down b u tton Decreases system volume . 3 V olume up button Increases system vo lume.
1–20 Maintenance and Serv ice Guide Product Description The external components on the bottom of the notebook are sho w n belo w and described in T able 1-8. Bott om Components Ta b l e 1 - 8 Bottom Components Item Component Function 1 Primar y batter y bay Holds the primar y batter y pack.
Product Description Maintenance and S ervi ce Guide 1–21 4 Memor y module compar tment Mini PCI compar tment Contains 1 memor y sl ot that suppor ts a replaceable memory module.
1–2 2 Maintenance and Serv ice Guide Product Description 1. 5 D e s i g n O v e r v i e w This section presents a design ov erview of ke y parts and features of the notebook. Refer to Chapter 4, “Illustrated Parts Catalog, ” to identify replacement parts, and Chapter 6, “Remov al and Replacement Procedures, ” for disassembly steps.
Maintenance and S ervi ce Guide 2–1 2 T roubleshooting Å W ARNI NG: Only author iz ed technic ians tr ained by HP should repair this equipment . All tr oubleshooting and r e pair pr ocedures ar e detailed to allo w only subass embly-/module-lev el repair .
2–2 Mainte nance and Service Gui de T roubleshooting Acce ssing Computer Setup The information and settings in Computer Setup are accessed from the File, Security , T ools, and Advanced menus. 1. Open Computer Setup by turning on or restarting the notebook.
T r oubleshooting Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follow the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you have entered is saved.
2–4 Mainte nance and Service Gui de T roubleshooting Selectin g from the Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass word Enter , change , or delete an HP Administrator pass word. P ower-on pass word Enter , change, or delete a pow er-on password.
T r oubleshooting Maintenance and S ervi ce Guide 2–5 Selectin g from the T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on any hard drive in the system. Battery Information View inf or matio n about any battery packs in the notebook.
2–6 Mainte nance and Service Gui de T roubleshooting Selec ting from the Adv anced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disable MultiBoot, which sets a startup sequence that can include most bootable devices and media in the system.
T r oubleshooting Maintenance and S ervi ce Guide 2–7 2.2 T roubleshootin g Flo wc har ts Ta b l e 2 - 5 T roubleshooting Flo wchar ts Overview Flowchart Description 2.1 “Flowchart 2.1—Initial T roubleshooting” 2.2 “Flowchart 2.2—No Po wer , P ar t 1” 2.
2–8 Mainte nance and Service Gui de T roubleshooting Flowchart Description 2.14 “Flowchart 2.14—No OS Loading, Optical Dr ive” 2.15 “Flowchart 2.15—No Audio , P ar t 1” 2.16 “Flowchart 2.16—No Audio , P ar t 2” 2.17 “Flowchart 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–9 Flo wc har t 2. 1—Initial T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.
2–10 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2.2—No P ow er , P ar t 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from docking device (if applicable).
T r oubleshooting Maintenance and S ervi ce Guide 2–11 Flo wc har t 2.3—No P o wer , P ar t 2 Continued from “Flowchart 2.2—No Po we r , Pa r t 1 .” Visually check for debris in batter y socket and clean if necessary . Done N Y Po we r o n? Check battery by recharging it, moving it to another notebook, or replacing it.
2–12 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2.4—No P ow er , P ar t 3 Continued from “Flowchart 2.3—No Pow er , Par t 2 .” Reseat AC adapter in notebook and at pow er sou rce. Internal or external AC adapter? Done Done Done Done Po we r o n? Pow e r o n? Po we r o n? Plug directly into AC outlet.
T r oubleshooting Maintenance and S ervi ce Guide 2–13 Flowc ha r t 2.5— No P ow er , P ar t 4 Y N Continued from “Flowchart 2.4—No Po we r , Pa r t 3 .” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest.
2–14 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2.6—No Vid eo, P art 1 A N Stand-alone or docking device? No video. Replace the following one at a time. T est after each replacement. 1. Cable between notebook and notebook display (if applicable) 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–15 Flo wc har t 2.7—No Vid eo, P art 2 Y N Continued from “Flowchart 2.6—No Video, Part 1.” Done Adjust external monitor display .
2–16 Maintenance and Serv ice Guide T roubleshooting F lo wcha rt 2. 8— Non fu nct i oni ng Do cki ng D e v ic e (if applicable) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device.
T r oubleshooting Maintenance and S ervi ce Guide 2–17 Flo wc har t 2.9—No O peratin g S ystem (OS) Loading No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat power cord in docking device and power outlet.
2–18 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2. 1 0—N o OS Loadin g, H ard Driv e, Pa r t 1 Go to “Flowchart 2.17—Non- functioning Device.” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–19 Flowc h ar t 2. 1 1—N o O S L oa di ng , H ard Drive, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat hard drive.
2–20 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2. 1 2—No OS Loading , H ard Driv e, Pa r t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2.” Clean virus. Done N Install OS and reboot.
T r oubleshooting Maintenance and S ervi ce Guide 2–21 Flo wc har t 2. 1 3—No OS Loadin g, Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive Done Y N Reseat diskette drive. OS not loading from diskette drive.
2–2 2 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2. 1 4—No OS Loadin g , Opti cal Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–2 3 Flo wc har t 2. 1 5—No Au dio, P ar t 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.
2–2 4 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2. 1 6—No Audio, P ar t 2 YN Continued from “Flowchart 2.15—No Audio, Part 1.” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker .
T r oubleshooting Maintenance and Se r vi ce Guide 2–2 5 Flo wc har t 2. 1 7—Nonfun ctionin g Dev ice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage.
2–2 6 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2. 1 8—Nonfunc tioning K ey board Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board.
T r oubleshooting Maintenance and S ervi ce Guide 2–2 7 Flo wc har t 2. 1 9—N onfunc tioning P oin ting De vice Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device.
2–2 8 Maintenance and Serv ice Guide T roubleshooting Flo wc har t 2.20—No Net wor k/Modem Conne c tion Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated.
Maintenance and S ervi ce Guide 3–1 3 Soft w are Upda te an d Rec o v e r y Soft war e U pda tes T o stay current with the newest technology and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a vailable.
3–2 Mainte nance and Service Gui de Softw are Update and R ecov er y Accessing C omp uter Information Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel.
Softwar e Update and Reco very Maintenance and S ervi ce Guide 3–3 Soft ware Updates an d t he HP W eb Site Most software on the HP W eb site is packaged in compressed files called SoftP aq s. Some BIOS updates may be packaged in compressed files called RO M P a q s.
3–4 Mainte nance and Service Gui de Softw are Update and R ecov er y 3. At the do wnload area: a. Identify the BIOS update that is later than the BIOS version currently installed on your computer . Make a note of the date, name, or other identifier .
Softwar e Update and Reco very Maintenance and S ervi ce Guide 3–5 3. Double-click the file with an .e xe extension (for e xample, filename.e xe). The BIOS installation begins. 4. Complete the installation by follo wing the instructions on the screen.
3–6 Mainte nance and Service Gui de Softw are Update and R ecov er y 3. Insert the correct R OMPaq diskette for the product being updated. The BIOS image file must to be located in the root directory of the diskette and must be in contiguous sectors.
Maintenance and S ervi ce Guide 4–1 4 I llustra ted P ar ts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Serial N umber Location When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook.
4–2 Mainte nance and Service Gui de Illustr ated P ar ts Catalog 4.2 Notebook Major C ompon ents Notebook Maj o r Components.
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 1 Display assemb lies (include wireless antenna boards and cables) 15.0-inch, SXGA+WV A, TFT 15.
4–4 Mainte nance and Service Gui de Illustr ated P ar ts Catalog Notebook Maj o r Components.
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P ar t Number Miscellaneous Plastics Kit 3.
4–6 Mainte nance and Service Gui de Illustr ated P ar ts Catalog Notebook Maj o r Components.
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P ar t Number 18 Mini PCI communications car ds 802.11b/g WLAN card, fo r us e in most of the world 802.
4–8 Mainte nance and Service Gui de Illustr ated P ar ts Catalog 4.3 Miscell aneous Plas tic s Kit T able 4-2 Miscellaneous Plastics Kit Spare P ar t Number 378236-001 Item Description 1 Memor y mod.
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–9 4.4 Miscell aneous C a ble Kit Ta b l e 4 - 3 Miscellaneous Cable Kit Spare P ar t Number 395465-001 Item Description 1 Bluetooth boa.
4–10 Maintenance and Serv ice Guide Illustr ated P ar ts Catalog 4.5 Mas s Storage D e vices Ta b l e 4 - 4 Mass Storage Devices Spare P ar t Number Information Item Description Spare P ar t Number .
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–11 4.6 Miscell aneous (N ot I llustra ted) Ta b l e 4 - 5 Miscellaneous (Not Illustrated) Spare P ar t Information Description Spare P .
4–12 Maintenance and Serv ice Guide Illustr ated P ar ts Catalog Screw Kit (includes the f ollowing screws; ref er to Appendix C, “Screw Listing,” f or more inf or mation on specifications and usage 378235-001 ■ He x socket HM5.0×9.0 scre w lock ■ Phillips PM2.
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–13 4.7 Sequen tial P ar t Number Lis ting Ta b l e 4 - 6 Sequential P ar t Number Listing Spare P ar t Number Description 239704-001 65.
4–14 Maintenance and Serv ice Guide Illustr ated P ar ts Catalog 373900-021 802.11a/b/g combination WLAN Mini PCI communications card, f or use in the Asia Pacific region 373901-002 802.
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 4–15 378237-001 Speaker 379799-001 Heat sink (i ncludes thermal paste) 380089-001 Docking Station Mi scellaneous Plastics Kit 380107-001 .
4–16 Maintenance and Serv ice Guide Illustr ated P ar ts Catalog 397243-001 K eyboard f or us e in the United States 397243-281 K eyboard f o r use in Thailand 397243-AB1 K eyboard f or use in T aiw.
Maintenance and S ervi ce Guide 5–1 5 Remo v al an d Repl acem ent Preliminaries This chapter provides essential information for proper and safe remov al and replacement service.
5–2 Mainte nance and Service Gui de Remo val and R eplacement Pre liminaries 5 .2 Ser vice C onsidera tions The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures.
Remo val and R eplacement Pr eliminarie s Maintenance and S ervi ce Guide 5–3 5 .3 Pr e v enti ng Damage t o Re mo v able Dri v es Remov able driv es are fragile components that must be handled with care.
5–4 Mainte nance and Service Gui de Remo val and R eplacement Pre liminaries 5 .4 Pre v entin g Elec trostati c Dam ag e Many electronic components are sensiti ve to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensiti vity .
Remo val and R eplacement Pr eliminarie s Maintenance and S ervi ce Guide 5–5 5 .5 P ac k a ging an d T rans por ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes.
5–6 Mainte nance and Service Gui de Remo val and R eplacement Pre liminaries 5 .6 W orkstation Precau tions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with approved static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ).
Remo val and R eplacement Pr eliminarie s Maintenance and S ervi ce Guide 5–7 ■ When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots.
5–8 Mainte nance and Service Gui de Remo val and R eplacement Pre liminaries T able 5-1 shows ho w humidity affects the electrostatic v oltage le vels generated by dif ferent activities. T able 5-2 lists the shielding protection provided by antistatic bags and floor mats.
Maintenance and S ervi ce Guide 6–1 6 Remo v al an d Repl acem ent Procedur es This chapter provides remo val and replacement procedures. There are 64 scre ws and screw locks, in 11 dif ferent sizes, that must be remov ed, replaced, or loosened when servicing the notebook.
6–2 Mainte nance and Service Gui de Remo val and R eplacement Pr ocedure s 6. 1 Serial N umber Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Ser ial Number Locati on 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–3 6.4 Hard drive 2 loosened to remov e the hard drive cov er 1 loosened to remov e the hard drive 6 to disassemble the hard drive 6.5 Notebook f eet 0 6.6 Bluetooth board 0 6.7 External memor y module 1 loosened to remov e the memor y module/Mini PCI compar tment cove r 6.
6–4 Mainte nance and Service Gui de Remo val and R eplacement Pr ocedure s 6. 3 Preparing t he Notebook for Disasse mbl y Before you begin an y remova l or installation procedures: 1.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–5 4. Remov e the battery pack by follo wing these steps: a. T urn the notebook upside do wn with the rear panel to ward you. b . Slide and hold the battery pack lock latch 1 to the right.
6–6 Mainte nance and Service Gui de Remo val and R eplacement Pr ocedure s 6.4 Hard Driv e 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Loosen the two PM2.0×4.0 scre ws 1 that secure the hard dri ve cov er to the notebook. 3.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–7 5. Loosen the PM2.5×13.0 spring-loaded hard dri ve retention scre w 1 . 6. Grasp the mylar tab 2 on the hard dri ve and slide the hard dri ve to the right 3 to disconnect it from the system board.
6–8 Mainte nance and Service Gui de Remo val and R eplacement Pr ocedure s 8. Remov e the two PM2.5×4.0 hard driv e frame shoulder scre ws 1 from each side of the hard drive. 9. Remov e the two PM2.5×4.0 hard driv e frame screws 2 from each side of the hard dri ve.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi ve-backed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 378236-001.
6–10 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.6 Bluetooth B oard 1. Prepare the notebook for disassembly (refer to Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–11 3. Slide the Bluetooth board out of the clip 1 in the hard dri ve compartment. 4. Disconnect the Bluetooth board cable 2 from the board. Re mov ing the Bluetooth Board Re verse the abov e procedure to install a Bluetooth board.
6–12 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.7 Exter n al Memor y Modul e 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Loosen the PM2.0×4.0 scre w 1 that secures the memory module/Mini PCI compartment cov er to the notebook.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–13 6. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.
6–14 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.8 Mini PCI Communi cations C ard 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment cover ( Section 6.7 ). 3. Position the notebook with the front to ward you.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–15 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card. ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables.
6–16 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.9 Optical Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment cover ( Section 6.7 ). 3. Position the notebook with the left side to ward you.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–17 4. Remov e the T8M2.0×9.0 screw 1 that secures the optical dri ve to the notebook. 5. Insert a thin tool, such as an unbent paper clip 2 , into the media tray release hole and release the media tray .
6–18 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 0 Ke ybo ard 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment cover ( Section 6.7 ). 3. Remov e the two T8M2.0×9.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–19 4. T urn the notebook display-side up with the front to ward you. 5. Open the notebook as far as possible.
6–20 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 7. Lift the rear edge of the ke yboard up and swing it toward you until it rests on the palm rest.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–21 8. Release the zero insertion force (ZIF) connector 1 to which the ke yboard cable is attached and disconnect the keyboard cable 2 . Disconnec ting the K eyboar d Cable 9. Remov e the keyboard.
6–2 2 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 1 S w itc h C ov er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the keyboard ( Section 6.10 ). 3. Close the notebook. 4. T urn the notebook upside do wn with the rear panel to ward you.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–2 3 6. T urn the notebook display-side up with front to ward you. 7. Open the notebook as far as possible.
6–2 4 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 2 LED Board 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the keyboard ( Section 6.10 ). 3. Remov e the switch cover ( Section 6.11 ). 4. T urn the notebook upside do wn with the rear panel to ward you.
Re moval and R eplacement Pr ocedures Maintenance and Se r vi ce Guide 6–2 5 6. Remov e the four PM1.5×4.0 screws 1 that secure the LED board to the switch cov er . 7. Remov e the LED board 2 . Re mov ing the LED Board Re verse the abov e procedure to install the LED board.
6–2 6 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 3 Fan 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the keyboard ( Section 6.10 ). 3. Disconnect the fan cable 1 from the system board. 4. Loosen the 2 PM2.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–2 7 6. 1 4 Hea t Sink 1. Prepare the notebook for disassembly ( Section 6.3 ).
6–2 8 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 4. Loosen the four PM2.0×8.0 shoulder scre ws 1 that secure the heat sink to the notebook. 5. Lift the right side of the heat sink 2 to disengage it from the processor . 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–2 9 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste should be reapplied to both surfaces before the heat sink is reinstalled.
6–30 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 5 Proc es sor 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the keyboard ( Section 6.10 ). 3. Remov e the fan ( Section 6.13 ). 4. Remov e the heat sink ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–31 5. Use a flat-bladed scre wdriver to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear ac l i c k . 6. Lift the processor straight up and remov e it 2 .
6–3 2 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 6 Internal Memor y Modul e 1. Prepare the notebook for disassembly ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–3 3 3. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.
6–34 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 7 RT C B a t te r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 378236-001. 1. Prepare the notebook for disassembly ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–3 5 6 . 1 8 Di splay Assembl y 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
6–3 6 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 5. Disconnect the display cable 1 from the system board. 6. Remov e the wireless antenna cables from the Mini PCI compartment and the top cov er clips 2 . 7. Remov e the two T8M2.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–3 7 8. Swing the display assembly into a partially closed position. 9. Position the notebook with the rear panel to ward you. Ä CAUT I ON: Su ppor t the display as sembly whe n remo ving the follo w ing scr ew s.
6–38 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6. 1 9 T op C o ver 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and Se r vi ce Guide 6–3 9 3. Remov e the thirteen T8M2.0×9.0 screws that secure the top cov er to the notebook.
6–40 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the two T8M2.0×9.0 screws 1 that secure the top cov er to the notebook. 6. Disconnect the T ouchPad cable 2 from the system board.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–41 7. Lift up the rear edge of the top cov er 1 until it disengages from the base enclosure. 8. Swing the top cov er toward you 2 until the left and right sides of the top cov er disengage from the base enclosure.
6–4 2 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.2 0 Sp e ak e r 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–4 3 3. Remov e the six T8M2.0×4.0 screws 1 that secure the speaker to the notebook. 4. Lift the speaker up 2 until it clears the system board. 5. Slide the speaker to ward you 3 and remov e it.
6–44 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.2 1 Mod e m B o ard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–4 5 2. Remov e the two PM2.0×3.0 screws 1 that secure the modem board to the notebook. 3. Lift the front edge of the modem board 2 to disconnect it from the system board. 4. Disconnect the modem cable 3 from the modem board.
6–46 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.2 2 Di gital Medi a Board 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–4 7 2. Release the ZIF connector to which the digital media board cable is attached and disconnect the digital media board cable 1 from the system board. 3. Remov e the digital media board 2 .
6–48 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.2 3 USB/Au dio Board 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–4 9 2. Position the notebook with the rear panel to ward you. 3. Disconnect the USB cable 1 and audio cable 2 from the system board. 4. Remov e the PM1.5×3.0 screw 3 that secures the USB/audio board and shield to the base enclosure.
6–50 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 6.24 S yst em B oa rd ✎ When replacing the system board, ensure that the follo w ing components are remov ed from the defectiv e system board and installed on the replacement system board: ■ Memory modules ( Section 6.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–51 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.6 ) c. Optical dri ve ( Section 6.
6–5 2 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 3. Disconnect the serial connector cable 1 and the Bluetooth cable 2 from the system board. 4. Remov e the T8M2.0×4.0 screw 3 that secures the system board to the base enclosure next to the RJ-11 connector .
Re moval and R eplacement Pr ocedures Maintenance and Se r vi ce Guide 6–5 3 7. Use the optical dri ve connector to lift the system board up 1 until the po wer connector 2 is clear of the base enclosure. 8. Slide the system board to the left 3 at an angle and remov e it.
6–54 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 9. If necessary , disconnect the RJ-11 connector module cable from the system board and remov e the RJ-11 connector module and cable. Re mov ing the RJ-11 Connecto r Module and Cable Re verse the abov e procedures to install the system board.
Re moval and R eplacement Pr ocedures Maintenance and S ervi ce Guide 6–5 5 6.2 5 Serial Conn ec tor Module 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.
6–5 6 Maintenance and Serv ice Guide Remo val and R eplacement Pr ocedure s 3. Remov e the two HM5.0×9.0 screw locks 1 on each side of the serial connector . 4. Lift the serial connector module and cable out of the base enclosure 2 . 5. Disconnect the serial connector module cable from the system board 3 .
Maintenance and S ervi ce Guide 7–1 7 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height Width Depth 32.8 cm 26.7 cm 3.1 cm 12.91 10.51 1.22 W eight 2.66 kg 5.86 lbs Input P ower Operating v oltage Operating current 18.
7–2 Mainte nance and Service Gui de Spe cificat ion s Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperating 125 g, 2 ms, half-sine 200 g, 2 ms, half-sine Random Vibration Operating Nonoperating 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 15.0-inch, SXGA+WV A, TFT Display Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 300:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
7–4 Mainte nance and Service Gui de Spe cificat ion s Ta b l e 7 - 3 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 14.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 28.5 cm 21.3 cm 35.8 cm 11.2 in 8.4 in 14.1 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
7–6 Mainte nance and Service Gui de Spe cificat ion s Ta b l e 7 - 5 Hard Drives 80-GB* 60-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.
Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 Primary 6-cell, Li-Ion Battery Pac k Dimensions Height Width Depth We i g h t 2.00 cm 5.30 cm 20.30 cm 0.34 kg 0.79 in 2.10 in 8.00 in 0.74 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.
7–8 Mainte nance and Service Gui de Spe cificat ion s Ta b l e 7 - 7 DV D - R O M D r i v e Applicable disc DV D - R O M ( DV D - 5 , DV D - 9 , DV D - 1 0 , DV D - 1 8 ) CD-ROM (Mode 1 and 2) CD Di.
Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 8 D VD/CD-R W Combo Drive Applicable disc Read: D VD-R, D VD-R W , D VD-ROM (D VD-5, D VD-9, D VD-10, DV D - 1 8 ) , CD-ROM (Mode 1.
7–10 Maintenance and Serv ice Guide Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD media D VD media Random Full stroke < 110 ms < 210 ms < 130 ms < 225 ms A u dio output level Line-out, 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–11 Ta b l e 7 - 9 D VD±R W and CD-R W Combo Drive Applicable disc Read: DV D - R , DV D - R W, D VD-ROM (D VD-5, DV D - 9 , DV D - 1 0 , DV D - 1.
7–12 Maintenance and Serv ice Guide Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full stroke < 175 ms < 285 ms < 230 ms < 335 ms A u dio output level Audio-out, 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–13 T able 7-10 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 SMC IrCC - F ast Infrar.
7–14 Maintenance and Serv ice Guide Spe cificat ion s T able 7-11 System Interrupts IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K ey or Microsoft Natural K eyboard IRQ2 Cascaded IRQ.
Spe cificat ion s Maintenance and S ervi ce Guide 7–15 IRQ11* Intel 82801FB/FBM USB Univ ersal Host Controller - 2659 Intel 82801FB/FBM USB Univer sal Host Controller - 265A Broadcom NetXtreme Gigab.
7–16 Maintenance and Serv ice Guide Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 054 - 059 Unused 060 K eyboard controller 061 System speaker 062 MS A CPI-Compliant .
Spe cificat ion s Maintenance and S ervi ce Guide 7–17 I/O Address (he x) System Function (shipping configuration) 100 - 10F SMC IrCC - F ast Infrared P or t 110 - 1EF Un used 1F0 - 1F7 Primary IDE .
7–18 Maintenance and Serv ice Guide Spe cificat ion s T able 7-13 System Memory Map Size Memor y Address System Function 640 KB 00000000 - 0009FFFF Base memory 128 KB 000A0000 - 000BFFFF Video memor.
Maintenance and S ervi ce Guide A–1 A Conn ec tor P in A ssi gnm ents Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 Audio out, left channel 3 Ground 2 Audio out, right channel.
A–2 Mainte nance and Service Gui de Connec tor Pin Assi g nments Ta b l e A - 2 A udio-In (Microphone) Pin Signal Pin Signal 1 Audio signal in 3 Ground 2 Audio signal in Ta b l e A - 3 Universal Ser.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 Serial Pin Signal Pin Signal 1 Carrier detect 6 D ata set ready 2 Receive data 7 Ready to send 3 T ransmit data 8 Clear.
A–4 Mainte nance and Service Gui de Connec tor Pin Assi g nments Ta b l e A - 5 P arallel P or t Pin Signal Pin Signal 1 Strobe 14 Auto linef eed 2 Data bit 0 1 5 Error 3 Data bit 1 1 6 Initialize p.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 7-Pin S-Video-Out Pin Signal Pin Signal 1 C (chrominance) 5 Composite video 2 Ground 6 Unused 3 Y (luminance) 7 Ground .
A–6 Mainte nance and Service Gui de Connec tor Pin Assi g nments Ta b l e A - 7 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect .
Connec tor P in Assignments Maintenance and S ervi ce Guide A–7 Ta b l e A - 8 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused.
A–8 Mainte nance and Service Gui de Connec tor Pin Assi g nments Ta b l e A - 9 RJ-45 (Network) Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receive – 3 Receive + 7 Unused 4 Unus.
Maintenance and S ervi ce Guide B–1 B P o w er C ord Set Requ irements 3-Con duc tor P o wer Cord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C.
B–2 Maint enance and Service Gui de P owe r Cord Set Requir ements Gen eral Requirements The requirements listed belo w are applicable to all countries. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.
P ow er Cord Set Requir ements Maintenance and S ervi ce Guide B–3 Countr y- Spec ifi c Requirements 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Note Number.
B–4 Maint enance and Service Gui de P owe r Cord Set Requir ements Ko r e a E K 4 The Netherlands KEMA 1 Norwa y NEMK O 1 P eople’ s Republic of China CCC 5 Sweden SEMK O 1 Switzerland SEV 1 T aiwan BSMI 4 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1.
Maintenance and S ervi ce Guide C–1 C Scre w List ing This appendix provides specif ication and reference information for the scre ws and screw locks used in the notebook. All scre ws and scre w locks listed in this appendix are av ailable in the Scre w Kit, spare part number 378235-001.
C–2 Main tenance and Servi ce Guide Scr ew Listin g Phillips P M2 .0×4. 0 Scr ew L ocations Ta b l e C - 1 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.
Scr ew Listin g Maintenance and S ervi ce Guide C–3 Phillips P M2 .5×13 .0 Scr ew L o cation Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Hard Drive Retention Scre w Color Qty .
C–4 Main tenance and Servi ce Guide Scr ew Listin g Phillips P M2 .5×4. 0 Shoulder Sc re w , Phillips P M2 . 5×4.0 Sc re w , and Phillips P M1. 5×3. 5 Scr ew L ocations Ta b l e C - 3 Phillips PM2.5×4.0 Shoulder Screw , Phillips PM2.5×4.0 Screw , and Phillips PM1.
Scr ew Listin g Maintenance and S ervi ce Guide C–5 T orx T8M2 .0×9 . 0 Scr ew L ocation Ta b l e C - 4 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the optical dr iv e to the notebook (documented in Section 6.
C–6 Main tenance and Servi ce Guide Scr ew Listin g T orx T8M2 .0×9 . 0 Scr ew L ocations Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the k eyboard to the notebook (documented in Section 6.
Scr ew Listin g Maintenance and S ervi ce Guide C–7 T orx T8M2 .0×9 . 0 Scr ew L ocations Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.
C–8 Main tenance and Servi ce Guide Scr ew Listin g T orx T8M2 .0×9 . 0 Scr ew L ocations Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 4 screws that secure the displa y asse mbly to the notebook (documented in Section 6.
Scr ew Listin g Maintenance and S ervi ce Guide C–9 T orx T8M2 .0×9 . 0 Scr ew L ocations Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 13 screws that secure the top co ver to the notebook (documented in Section 6.
C–10 Maintenance and S er vi ce Guide Scr ew Listin g T orx T8M2 .0×9 . 0 Scr ew L ocations Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the top co ve r to the notebook (documented in Section 6.
Scr ew Listin g Maintenance and S ervi ce Guide C–11 T orx T8M2 .0×2 .0 S cr ew L o cations Ta b l e C - 5 T orx T8M2.0×2.0 Screw Color Qty . Length Thread Head Width Black 2 2.0 mm 2.0 mm 6.0 mm Where used: 2 screws that secure the s witch co v er to the notebook (documented in Section 6.
C–12 Maintenance and S er vi ce Guide Scr ew Listin g Phillips P M1. 5×4.0 Sc re w Locati ons Ta b l e C - 6 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Silver 4 4.0 mm 1.5 mm 4.0 mm Where used: 4 screws that secure the LED board to the s witch cov er (documented in Section 6.
Scr ew Listin g Maintenance and S ervi ce Guide C–13 Philli ps P M 2 .0×7 .0 Sc rew L oc ations Ta b l e C - 7 Phillips PM2.0×7.0 Screw Color Qty . Length Thread Head Width Silver 2 7.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the f an to the notebook (screws are captured on the f an assembly b y an O clip; documented in Section 6.
C–14 Maintenance and S er vi ce Guide Scr ew Listin g Phillips P M2 .0×8. 0 Shoulder Sc re w Locati ons Ta b l e C - 8 Phillips PM2.0×8.0 Shoulder Screw Color Qty .
Scr ew Listin g Maintenance and S ervi ce Guide C–15 Phillips PM2 .0×3 .0 Sc re w Locations Ta b l e C - 9 Phillips PM2.0×3.0 Screw Color Qty . Length Thread Head Width Black 2 3.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the modem boar d to the notebook (documented in Section 6.
C–16 Maintenance and S er vi ce Guide Scr ew Listin g T orx T8M2 .0×4. 0 Scr e w Locations T able C-10 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: 6 screws that secure the speak er to the notebook (documented in Section 6.
Scr ew Listin g Maintenance and S ervi ce Guide C–17 T orx T8M2 .0×4. 0 Scr e w Location T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the USB/audio board the notebook (documented in Section 6.
C–18 Maintenance and S er vi ce Guide Scr ew Listin g T orx T8M2 .0×4. 0 Scr e w Location T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the system board the notebook (documented in Section 6.
Scr ew Listin g Maintenance and S ervi ce Guide C–19 Hex S ock et HM5. 0×9 . 0 Scr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Lock Color Qty . Length Thread Head Width Silver 6 9.0 mm 2.5 mm 5.0 mm Where used: 1 T wo scre w locks that secure the system board to the notebook (documented in Section 6.
C–20 Maintenance and S er vi ce Guide Scr ew Listin g Hex S ock et HM5. 0×9 . 0 Scr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Loc k (Continued) Color Qty . Length Thread Head Width Silver 6 9.0 mm 2.5 mm 5.0 mm Where used: 2 screw loc ks that secure the seri al connector board to the system board (documented in Section 6.
Maintenance and S ervi ce Guide Index–1 Ind e x 1394 port 1–11 6-in-1 Digital Media Slot 1–7 6-in-1 Digital Media Slot light 1–7 A AC adapter, spare part numbers 4–11 , 4–13 arrow keys 1.
Index–2 Maintenance and S er vi ce Guide Index Computer Setup Advanced Menu 2–6 File Menu 2–3 overview 2–1 Security Menu 2–4 Tools Menu 2–5 Computer Setup defaults 2–2 connector pin assi.
Index Maintenance and S ervi ce Guide Index–3 DVD-ROM drive OS loading problems 2–17 precautions 5–3 removal 6–16 spare part number 4–7 , 4–10 , 4–15 , 6–16 specifications 7–8 E elec.
Index–4 Maintenance and S er vi ce Guide Index heat sink removal 6–27 spare part number 4–3 , 4–15 , 6–27 I I/O address specifications 7–15 Info Center button 1–17 infrared port 1–6 in.
Index Maintenance and S ervi ce Guide Index–5 modem cable illustrated 4–9 removal 6–54 modem jack location 1–11 pin assignments A–7 modem, troubleshooting 2–28 monitor port location 1–10.
Index–6 Maintenance and S er vi ce Guide Index RJ-11 connector module and cable illustrated 4–9 removal 6–54 RJ-11 jack location 1–11 pin assignments A–7 RJ-45 jack location 1–11 pin assig.
Index Maintenance and S ervi ce Guide Index–7 top cover removal 6–38 spare part number 4–3 , 4–15 , 6–38 TouchPad 1–19 TouchPad buttons 1–19 TouchPad scroll zone 1–19 transporting prec.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté HP (Hewlett-Packard) nx6130 c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du HP (Hewlett-Packard) nx6130 - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation HP (Hewlett-Packard) nx6130, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le HP (Hewlett-Packard) nx6130 va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le HP (Hewlett-Packard) nx6130, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du HP (Hewlett-Packard) nx6130.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le HP (Hewlett-Packard) nx6130. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei HP (Hewlett-Packard) nx6130 ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
