Manuel d'utilisation / d'entretien du produit BL685c du fabricant HP (Hewlett-Packard)
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HP Pr oL iant BL6 8 5c Se r v er Blade Maintenance and S erv i ce Guid e Part Number 418533- 007 May 2008 (Sev enth Edition).
© Copyright 2006, 2008 Hewlett-Pa ckard Development Company, L.P. The in formati on con taine d here in is subject to chan ge with out n otice. The on ly war ranti es for H P produ cts and serv ices ar e set forth in th e ex press warrant y stat ements accom panyin g such produ cts and serv ices.
Contents 3 Con t e nt s Custom er self repair ........................................................................................................... ........... 5 Parts only warran ty servi ce .....................................................
Contents 4 External U SB func tionalit y ..................................................................................................... ............ 55 Componen t identification ..................................................................
Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize r epair time and allow for greater flexibility in performing defective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour l esquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d' œuv re du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste par ti siano sostituit e da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR- Ersatzteil geliefert werden, k önnen Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y recibirá ay uda telefónica por parte de un técni co. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectu osos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) we rkdagen, retourneren aan HP. Het defecte on derdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Customer self repair 11 Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para pe ças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rne ce as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts cata log Server blade components Item Description Spare part number Customer self repair (on page 5 ) 1 Heatsink 436380-001 Optional 2 2 Processor — — a) 3.0-GHz AMD O pteron™ Model 8222** 455279-001 Optional 2 b) 2.
Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5 ) h) 2.2-GH z AMD Opteron™ Model 8354* * * 448404-001 Optional 2 i) 1.
Illustrated parts catalog 18 Item Description Spare part number Customer self repair (on page 5 ) b) QLogi c QMH2462 4Gb FC HB A for HP c-Class BladeSystem 405920-001 Man datory 1 c) HP NC325m PCI Exp.
Illustrated parts catalog 19 2 Optional: Facultatif —Pièces pour lesquelles la réparation par le client est facultative. Ces pièces son t également conçues pour permettre au client d'ef fectuer lui-même la réparation .
Illustrated parts catalog 20.
Removal and replac ement procedures 21 R emo val and r eplacement pr ocedur es Required tools You need the following items for some pro cedures: • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information.
Removal and replac ement procedures 22 CAUTION: When performing non-hot-plug operatio ns, you must power down the serv er blade and/or the system. However, it may be necessary to leave the server blade powered up when performing other operations , such as hot-plug installatio ns or troubleshooting.
Removal and replac ement procedures 23 Power down the server blade Before powering down the server blade for any up grade or maintenance procedure s, perform a backup of critical server data and programs.
Removal and replac ement procedures 24 WARNING: To reduce the r isk of personal injury from h ot surfaces, allow the drives and the internal system components to cool before touch ing them. CAUTION: To prevent damage to electrical compon ents, properly ground the server blade before beginning any installation procedur e.
Removal and replac ement procedures 25 To replace the component, reve rse the removal procedure. Hard drive 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations (" SAS and SATA hard drive LED combinations " on page 58 ).
Removal and replac ement procedures 26 4. Remove the DIMM baffle. CAUTION: To avoid damage to the server blade and the enclosure, install all DIMM baffles in the proper location after adding or replacin g DIMMs. DIMM baffles that are missing or installed incorrectly can co mpromise server blade and enclosure cooling.
Removal and replac ement procedures 27 5. Remove the DIMM. To replace the component: 1. Install the DIMM. 2. Install the DIMM baffle. 3. Install the access panel (" Access panel " on page 24 ). 4. Install the server blade. 5. Use RBSU to verify the configuration.
Removal and replac ement procedures 28 4. Remove the mezzanine card. CAUTION: To prevent damage to the server blade, apply pressure over the mezzan ine connector when installing the mezzanine card. Do not apply pressure to the edges of the card. To replace the component, reve rse the removal procedure.
Removal and replac ement procedures 29 HP Smart Array E200i Controller cache module battery pack To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ).
Removal and replac ement procedures 30 4. Remove the SAS cable. To replace the component, reve rse the removal procedure. Hard drive backplane To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ).
Removal and replac ement procedures 31 7. Remove the hard drive backplane. To replace the component, reve rse the removal procedure. Front panel/hard drive cage assembly To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ).
Removal and replac ement procedures 32 Server blade handle To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove all hard drives (" Hard drive " on page 25 ).
Removal and replac ement procedures 33 7. Remove the release button. To replace the component, reve rse the removal procedure. Heatsink IMPORTA NT: Do not install the air baffles on heatsinks f or processors 3 and 4. To remove the component: 1. Power down the server blade (on page 23 ).
Removal and replac ement procedures 34 o Processor 3 or 4 o Processor 1 or 2 To replace the component: 1. Clean the old thermal grease from the proc esso r with the alcohol swab.
Removal and replac ement procedures 35 2. Remove the thermal interface protective cover from the heatsink. IMPORTA NT: Do not install the air baffles on heatsinks f or processors 3 and 4.
Removal and replac ement procedures 36 o Processor 3 or 4 o Processor 1 or 2 CAUTION: Heatsink retaining screws should be tigh tened in diagonally opposite pairs (in an "X" pattern).
Removal and replac ement procedures 37 o Processor 3 or 4 o Processor 1 or 2 6. Install the SAS cable, if remove d (" SAS cable " on page 29 ).
Removal and replac ement procedures 38 CAUTION: The server blade supports only two- or four-processor configurations . Always populate processor socket s 1 and 2 with processors and heat sinks. To prevent over heating, always populate processor sockets 3 and 4 with processors and heatsinks or pro cessor socket covers and heatsink blanks.
Removal and replac ement procedures 39 CAUTION: The pins on the processor socket ar e very fragile. Any damage to them may require replacing th e system board. CAUTION: Failure to completely open the processor loc king lever prevents the processor from seating during installation, leading to hardware damage.
Removal and replac ement procedures 40 3. Press down firmly until the processor installation t ool clicks and separates from the processor, and then remove the processor installation tool.
Removal and replac ement procedures 41 4. Close the processor retaining bracke t and the processor retaining latch. 5. Clean the old thermal grease from the heatsink with the alcohol swab.
Removal and replac ement procedures 42 o Processor 3 or 4 o Processor 1 or 2 CAUTION: Heatsink retaining screws should be tigh tened in diagonally opposite pairs (in an "X" pattern).
Removal and replac ement procedures 43 o Processor 3 or 4 o Processor 1 or 2 9. Install the SAS cable, if remove d (" SAS cable " on page 29 ). 10. Install the access panel (" Access panel " on page 24 ). 11. Install the server blade.
Removal and replac ement procedures 44 WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury : • Do not attempt to recharge the battery.
Removal and replac ement procedures 45 7. Remove the hard drive backplane (" Hard drive backplane " on page 30 ). 8. Remove the front panel/hard drive cage assembly (" Front panel/hard drive cage assembly " on page 31 ). 9. Remove all DIMM baffles (" DIMM baffle " on page 25 ).
Removal and replac ement procedures 46 CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover afte r removing the processor from the sock et. • Do not tilt or slide the processor when lowering the processor into the so cket.
Removal and replac ement procedures 47 a. Remove the processor socket protective cover. b. Open the processor retaining latch and th e processor socket retaining bracket. 3. Install the processor socket cover onto the proc essor socket of the failed sy stem board.
Removal and replac ement procedures 48 5. Close the processor retaining latch and th e processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
Removal and replac ement procedures 49 IMPORTA NT: When replacing multiple processors, inst all heatsinks with attached air baffles on processors 1 and 2 only. 8. Install the heatsink. IMPORTA NT: Install all components with the same configuration that was used on t he failed system board.
Cabling 50 Cabl in g SAS cable routing Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and US B devices directly to the server blade.
Cabling 51 Acces sing a server blade with lo cal KVM CAUTION: Before disconnecting the SUV cable from the connector, always squeeze the release buttons on the sides of the connector. Fa ilure to do so can result in damage to the equipment. NOTE: For this configuratio n, a USB hub is no t necessary.
Cabling 52 o USB CD/DVD-ROM drive o USB keyboard o USB mouse o USB diskette drive NOTE: Use a USB hub when connecting a USB diskette drive and/or USB CD-ROM drive to the server blade.
Diagnostic tools 53 Di agno sti c too ls Troubleshooting resources The HP ProLiant Serve rs Troubleshooting Guide provides procedures for resolving c ommon problems and comprehensive courses of action.
Diagnostic tools 54 This functionality supports operatin g systems that may not be supported by the server blade. For operating systems supported by the server blade, see the HP webs ite ( http://www.
Diagnostic tools 55 Legacy USB support provides USB functionality in env ironments where USB support is normally not available. Specifically, HP prov ides legacy USB functionality for: • POST • RB.
Component identification 56 C ompo nent identif icati on Front panel components Item Description 1 Hard drive bay 2 2 Server blade handle 3 Server blade handle release bu tton 4 Serial pull tab 5 Hard.
Component identification 57 Front panel LEDs Item Description Status 1 UID LED Blue = Identified Blue fla shing = A ctive remote manageme nt Off = No act ive remot e manag ement 2 Health LED Green = N.
Component identification 58 SAS and SATA hard drive LEDs Item Description 1 Fault/U ID LED (amber/blue) 2 Onlin e LED (gree n) SAS and SATA hard drive LED combinations Online/activity LED (gr een) Fau.
Component identification 59 Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation Flashing irreg ularly Amber, flashin g regularly (1 Hz) The drive i s active, but a predicti ve failure alert has been received for th is drive. Replace the drive as soon as possible.
Component identification 60 Item Description 13 Enclosure connector 2 14 System board thum bscrew 15 Embedded NIC 16 Embedded NIC 17 Smart Array E200i cach e module (under mezzanine card 3) 18 SAS cab.
Component identification 61 System maintenance switch Position Fu nction Default 1* iLO 2 security overri de Off 2 Confi guratio n lock Off 3 Reserved Off 4 Reserved Off 5* Password disabled Off 6* Reset co nfigura tion Off 7 Reserved Off 8 Reserved Off *To access redundan t ROM, set S1, S5, and S6 t o ON.
Component identification 62 Accessin g the redundant R OM If the system ROM is not corrupted, use RBSU to switch to the redundant RO M. If the system ROM is corrupted, the system automatically switches to th e redundant R OM in most cases. If the system does not auto matically switch to the redundant ROM, perform the followi ng steps: 1.
Specifications 63 Sp e c i fic at io n s Environmental specifications Specification Value Tempera ture rang e* Operat ing 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F.
Acronyms an d abbreviations 64 A c r on y ms and abbr e v iati ons ADU Array Diagnostics Utility CSR Customer Self Repair DIMM dual inline memory module ESD electrostatic discharge FC Fibre Channel HB.
Acronyms an d abbreviations 65 PCI peripheral component interface PCIe peripheral component interconnect express RBSU ROM-Based S etup Utility ROM read-only memory SAS serial attached SCSI SATA serial.
Index 66 A access panel 24 ADU (Array Diagnostic Utility) 54 B battery 43 battery pack, removing 29 battery-backed write cache battery pack 29 buttons 56 C cables 50 cabling 50 cache module 2 8 cautio.
Index 67 removing the server blade 23 ROM redundancy 62 S safety considerations 21 safety information 21 SAS cabling 29, 50 SAS drives 58 SAS hard dri ve LEDs 58 SAS/SATA L ED combinati ons 58 SATA ha.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté HP (Hewlett-Packard) BL685c c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du HP (Hewlett-Packard) BL685c - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation HP (Hewlett-Packard) BL685c, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le HP (Hewlett-Packard) BL685c va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le HP (Hewlett-Packard) BL685c, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du HP (Hewlett-Packard) BL685c.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le HP (Hewlett-Packard) BL685c. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei HP (Hewlett-Packard) BL685c ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
