Manuel d'utilisation / d'entretien du produit 643064-001 du fabricant HP (Hewlett-Packard)
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HP Pr oL ian t DL5 8 0 G7 Serv er Maint enance and S er v i ce Guide Abstract This document describes service pr ocedures for the HP ProLiant DL58 0 G7 Server.
© Copyright 2010, 2012 Hewlett- Packard Development Company, L.P. The information contained herei n is subject to change without notice. The only wa rranties for HP products and services are set for th in the express warranty statements accompanyin g such products and services.
Contents 3 Con tents Customer self repair ...................................................................................................................... 5 Parts only warranty service ............................................................
Contents 4 Diagnostic tools .......................................................................................................................... 67 Troubleshooting resource s ......................................................................
Customer self repair 5 C u st omer s elf r epair HP products are desig ned with many Customer Se lf Repair (CSR) parts to mi nimize repair time and allow f or greater flex ibility in per forming def ective parts rep lacement.
Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuv re du service vo us seront facturé s. Facultatif - Piè ces pour lesquell es la réparation par le client est facultative.
Customer self repair 7 In base alla disponibi lità e alla località geograf ica, le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone.
Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Er satzteil in Rechnung stellen. Im Falle von Customer Self Repair ko mmt HP für alle Kost en für die Liefer ung un d Rücksendung auf u nd bestimmt den Kurier- /Frachtdienst.
Customer self repai r 9 enviara el componente defectuo so requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componentes y esco gerá la empresa de transpor te que se utilice para dic ho se rvicio.
Customer self repair 10 Neem contact op met e en Service Partner voo r meer informatie o ver het Customer Self Re pair programma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www.
Customer self repair 11 No caso desse se rviço, a substituição de peç as CSR é obrigatória. S e desejar que a HP su bstitua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 I llus tr ated part s catalog M echanical co mponents Item Description Spare part number Customer self repair (on page 5 ) 1 Plastics ki t 591209 - 001 — a) Bezel — Ma.
Illustrated parts catalog 17 Item Description Spare part number Customer sel f repair (on page 5 ) e) Blank, power supply — Mandatory 1 2 Access panel 591206 - 001 Mandatory 1 3 Processor memory dra.
Illustrated parts catalog 18 sustitución, pue de o no conllev ar costes adici onales, depe ndiendo del tipo de servicio de ga rantía corresp ondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser reparados por el usua rio.
Illustrated parts catalog 19 S ystem components Item Description Spare part number Customer self repair (on page 5 ) 6 Power supplies — — a) 1200 W, 9 0% 498152 - 001 Mandatory 1 b) 1200 W, 9 4%* .
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) e) Intel Xeon L7555 processor kit* ** 594900 - 0 01 Optional 2 f) Intel Xeon X7542 processor kit* ** 5.
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5 ) d) 8 - GB PC3 1060 0R, dual ran k* 501536 - 001 Mandatory 1 e) 8 - GB PC3L 1060 0R, dual ran k* 606427.
Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 5 ) f) BBWC cache module, 512 - MB* 462 975 - 001 Option al 2 g) BBWC batte ry pack* 462976 - 001 Optiona .
Illustrated parts catalog 23 2 Optional: Opziona li — Parti la cui riparazione da parte d el cliente è fac oltativa. Si tr atta comunque di co mponenti progett ati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP , potrebbe dover sostenere spese addizionali a seconda del tipo d i garanzia previs to per il pro dotto.
Illustrated parts catalog 24.
Removal an d replacement procedures 25 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following items for som e procedures: • Torx T - 15 screwdriver (pr ovided with the serv.
Removal an d replacement procedures 26 • Remove the s erver from the r ack (on page 27 ). If the rack environment, cabling configuration, or the server location in the rac k creates awkward conditions, remove the server from the rack. • Remove the acc ess panel (on page 28 ).
Removal an d replacement procedures 27 2. Extend the server on the r ack rails until the server rail - r elease latches en gage. 3. After performing the installation or maintenance procedure, slide the server into the r ack by pressing the server rail - release la tches.
Removal an d replacement pro cedures 28 2. Remove the fo llowing comp onents to reduce the w eight of the ser ver: o Processor memory drawer (" Remove the processor memory drawer " on page 29 ) o Hard drives (" SAS/SATA har d drive " on page 30 ) o Power supplies (" Hot - plug power supply " on page 47 ) 3.
Removal an d replacement procedures 29 R emove the processor memory drawer To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer shippi ng screws, if in stalled. Retain the screws for futur e use (" Processor memory drawer shipping screw locat ions " on page 28 ).
Removal an d replacement procedures 30 To replace th e component, reve rse the removal procedure . R emove the SPI boar d To remove the component: 1. Power off th e server. 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (on page 28 ).
Removal an d replacement procedures 31 3. Remove the hard drive. To replace th e component, rev erse the remova l procedure. H eatsink To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer shippi ng screws, if in stalled.
Removal an d replacement procedures 32 5. Open the processor retaining br acket. 6. Remove the h eatsink. To replace the compon ent: 1. Clean the old thermal grease from the top of the processor with th e alcohol swab. Allow the alcohol to evaporate before con tinuing.
Removal an d replacement procedures 33 2. Remove the h eatsink prote ctive cover. 3. Inst all the heatsink. 4. Close and lock the pr ocessor retaining bra cket. 5. Install the proce ssor memory drawer cover. 6. Install the processor me mory drawer. 7.
Removal an d replacement procedures 34 WARNING: U se caution when installing t he processor memory mod ule or removing the processor memory modu le. The processor memor y module is very heavy whe n fully populated.
Removal an d replacement procedures 35 5. Open the processor retaining bracket. 6. Remove the h eatsink..
Removal an d replacement procedures 36 7. Open the pro cessor lockin g lever and the p rocessor socket reta ining bracket. 8. Using the pro cessor tool, re move the proce ssor from the syst em board: a. Line up the proces sor tool, ensuring the locking l ever graphic on the tool is or iented correctly.
Removal an d replacement procedures 37 9. Carefully rotate the tool, and then push in and releas e the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.
Removal an d replacement procedures 38 2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processo r. THE PINS ON THE SYST EM BOARD ARE VERY F RAGILE AND EASILY DAMAG ED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGIL E AND EASILY DAMAGED.
Removal an d replacement procedures 39 3. Press and hold the tabs on the processor instal lation tool to separate it from the processor, and then remove the tool.
Removal an d replacement procedures 40 6. Apply all the grease to the top of the processor in the follo wing pattern to ensure even distribution. 7. Install the heatsink. 8. Close and lock the pr ocessor retaining bra cket. 9. Install the proce ssor memory drawer cover.
Removal an d replacement procedures 41 IMPORTANT: Be sure you are usin g the correct spare p art number when repla cing the memory cartridge. The server ships with one of two differe nt memory cartridges, which are not interchangeable. 1. Power down the serv er (on page 26 ).
Remo val and replacemen t procedures 42 6. Open the memory cartri dge cover. 7. Remove the D IMMs from the fa iled memory cart ridge: a. Open the DI MM slot latches. b. Remove the D IMM. To replace the compon ent: 1. Install the DIMMs in the replacement memory cartridge: a.
Removal an d replacement procedures 43 b. Install the DIMM. 2. Close the memory car tridge cover. 3. Install the memory cartridge. 4. Install the proce ssor memory drawer cover. 5. Install the processor me mory drawer. 6. Power up the server. D IMMs To remove the component: 1.
Removal an d replacement procedures 44 CAUTION: To preve nt damage to the processo r memory drawer c over, be sure the ha ndle of the processor memory drawer is fully open befor e removing the cover. 4. Be sure the handle on the processor memory drawer is completely open, and then remove the processor memory drawer cover.
Removal an d replacement procedures 45 6. Open the memory cartri dge cover. 7. Remove the fa iled DIMM fro m the memory cart ridge: a. Open the DI MM slot latches. b. Remove the D IMM. To replace the compon ent: 1. Install the replacement DIMM in the memory cartridge: a.
Removal an d replacement procedures 46 b. Install the DIMM. 2. Close the memory car tridge cover. 3. Install the memory cartridge. 4. Install the proce ssor memory drawer cover.
Removal an d replacement procedures 47 P ower su pply blank Remove the component as indic ated. To replace th e component, rev erse the remova l procedure. H ot - plug power supply The server sup ports up to four hot - plug power supplies. Install all power suppl ies to provide full redundanc y.
Removal an d replacement procedures 48 2. Remove the failed power supply. To replace th e component, rev erse the remova l procedure. S ystems Insight Disp lay assembly CAUTION: When routing cables, always be sure that the c ables are not in a position where they can be pinched or c rimped.
Removal and replacement procedures 49 To replace th e component, rev erse the remova l procedure. F an To remove the component: 1. Extend the server from the rack (on pag e 26 ). 2. Remove the a ccess panel (on page 28 ). 3. Remove the fa iled fan. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 50 5. Remove the fa n louver. CAUTION: Do not operat e the server unle ss a fan louver is installed nex t to fans 1 and 4. If t hese louvers are n ot installed, th e server overheat s. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 51 4. Release th e latches on the rel ease lever. 5. Lower the ha ndle, and th en extend the proce ssor memory dra wer from the serv er until the relea se latches catch. 6. Remove the a ccess pan el (on page 28 ). 7.
Removal an d replacement procedures 52 o PCI- X/PCIe Express I/O expansion board o PCIe Express I/O expansion board To replace th e component, rev erse the remova l procedure. DVD- ROM drive To remove the component: 1. Power down the serv er (on page 26 ).
Removal an d replacement procedures 53 3. Remove the a ccess panel (on page 28 ). 4. Disconnect the cable from the rear of the DVD - ROM drive . 5. Remove the DVD - ROM driv e. To replace th e component, rev erse the remova l procedure. S olid state drive To remove the component: 1.
Removal an d replacement procedures 54 To replace th e component, rev erse the remova l procedure. E xpansion slot cover CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all expansion slo ts have either an expansion s lot cover or an expansion boar d installed.
Removal an d replacement procedures 55 N on - hot - plug expan sion board CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all expansion slo ts have either an expansion s lot cover or an expansion boar d installed.
Removal an d repla cement procedures 56 7. Remove the expansion bo ard. To replace th e component, rev erse the removal procedure. Battery- backed wr ite cache proce dures Two types of proced ures are.
Removal an d replacement procedures 57 4. If the existi ng cache is conn ected to a battery , observe the BBWC Status LED (" Battery pack LEDs " on page 85 ). o If the LED is fl ashing every 2 secon ds, data is still tr apped in the cach e. Restore syst em power, and then repeat th e previous ste ps.
Removal an d replacement procedures 58 o If the LED is not illuminated, disconnect the battery c able from the cache. 5. Disconnect the cable. 6. Remove the battery pac k. The SPI board is re moved for clarity. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 59 o If the server h as failed, remove t he controller, cache module (" Removing the BBWC cache modu le " on page 56 ), and battery p ack (" Removing.
Removal an d replacement procedures 60 5. Disconnect the cable. 6. Remove the SPI board (o n page 30 ). 7. Open the cache slot latches. 8. Remove the c ache module.
Removal an d replacement procedures 61 To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (on page 28 ). 4. If the exist ing cache is conn ected to a bat tery, observe t he FBWC Status L ED (" FBWC mod ule LEDs " on page 87 ).
Removal an d replacement procedures 62 Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides powe r to the real - time c lock. WARNING: The compu ter contains an internal li thium manganese dioxide , a vanadiu m pentoxide, or an alkaline battery pack.
Removal an d repl acement procedure s 63 WARNING: The server weighs approxi mately 36.3 kg – 49.9 kg (80. 0 lb – 110.0 lb). To reduce the risk of inj ury, remove the fo llowing comp onents before .
Removal an d replacement procedures 64 1. Install th e spare system bo ard. 2. Install al l components rem oved from the ser ver. 3. Install the access panel. 4. Slide the server bac k into the rack. 5. Power up the server. After you repl ace the system b oard, you must re - enter the server serial number and the product ID.
Removal an d replacement procedures 65 S AS backpl ane To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (on page 28 ). 4. Remove all hard drives (" SAS/SATA hard drive " on pag e 30 ).
Removal an d replacement procedures 66 8. Remove the backpl ane. To replace th e component, rev erse the removal procedure. H P Truste d Platform Mo dule The TPM is no t a customer - removable part. CAUTION: Any attempt to remove an installed T PM from the system board bre aks or disfigures the TPM security r ivet.
Diagnostic tool s 67 D i agno sti c tools T roubleshooting resources The HP ProLiant Serv ers Troubleshooting Guid e provides procedure s for resolving common prob lems and comprehensiv e courses of a.
Diagnostic tool s 68 support ProLiant BL, ML, DL, and S L servers. The toolkit i ncludes a mod ular set of utiliti es and importan t documentation that describes how to apply these tools to buil d an automated server de ployment process. The Scriptin g Toolkit provides a flexible way to crea te standard server configuration scripts.
Diagnostic tool s 69 For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guid e o n the HP website ( http://www.
Diagnostic tool s 70 For more information, see the Management CD or DVD in the HP Ins ight Foundation suite for ProLiant. I nsight Lights -Out 3 techno logy The iLO 3 sub system is a stan dard component of selected ProLian t servers that p rovides server h ealth and remote server man ageability.
Diagnostic tool s 71 HP Insight Diagnosti cs Online Edition is a w eb - based applic ation that captures system configuration and other related data needed for eff ective serv er management. Available in Microsoft® Windows® and Linu x versions, the utility helps to ensure proper syste m operation.
Component ident ification 72 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 Ser ial and PID tag 2 Optical drive 3 Systems Insight Display 4 USB connect ors (2) 5 Video con.
Component id ent ification 73 F ront panel LEDs and b uttons Item Description Sta tus 1 UID button and LED Blue — Act ivated Blue (flashing) — Server being managed remotely Off — Deactiva ted 2 .
Component ident ification 74 S ystems Insight Disp lay The Systems Insight Display LEDs represent the se rver and component layou t. LED Description AMP status Off — No protection Green — Protecti.
Component ident ification 75 R ear panel comp onents Item Description Item Description 1 Power supply ba y 4 (optional) 15 Expansion slot 2 (op tional) 2 Power supply ba y 3 (optional) 16 Expansion sl.
Component ident ification 76 R ear panel LEDs and b uttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing — Network acti vity Off — No network a ctivity 2 iLO 3 NI.
Component ident ification 77 P ower su pply LED Power LED St atus Off No AC power to p ower supply units Green AC is present. Standby output i s on, output is disabled.
Component ident ification 78 S ystem board c omponents Item Description 1 Optional I/O ex pansion board connectors: • PCI - X/PCI Express I/ O expansion bo ard • PCI Express I/O expansion board 2 .
Component ident ification 79 S ystem maintena nce switch The system maintenance switch (SW1) is an eight - position switch that is u sed for system configuration. The default position for a ll eight positions is Off. Position Descript ion Function S1 iLO 3 security Off = iLO 3 se curity is enabled.
Component ident ification 80 S PI board compo nents Item Description 1 Mini - SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data con nector 5 RMII connecto r 6 SD card slot 7 Battery .
Component ident ification 81 I /O expansion board components • PCI- X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe 2 x16 (16, 8, 4, 2, 1) 2 Slot 4 PCIe 2 x8 (4, 2, 1)* 3 Slot 3 PCIe 2 x16 (16, 8, 4, 2, 1) 4 Slot 2 PCI -X 5 Slot 1 PCI -X *Slot 4 is physically a x8 slot but operates electrically as a x4 slot.
Component ident ification 82 **Slots 2, 3, 5 and 6 are physically x16 slots but operate el ectrically as x8 slots. P rocessors and memory cartridges The processor memory dr awer contains 4 proces sor sockets and 8 memory c artridges. For DIMM numbering an d installation guideline s, see the server user guide.
Component ident ification 83 D IMM slot location s Each memory module contains 8 DIMM slots . The paired banks are identi fied by the letters A through D.
Component ident ification 84 H ard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) H ard drive LED combina tions Online/activity LED (green) Fault/UID LED (amber/blue) In.
Component ident ification 85 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretat ion Off Steadily amber A critical faul t condition has been identified for this drive, a nd the controller has p laced it offline. Replace the drive as soon as possible.
Component ident ification 86 LED3 pattern LED4 pat tern Interpretation Off Flashing (2 Hz) The system is powered down, and the cac he contains data that has not yet been written to the drives. Restore system po wer as soon as possible to prevent data loss.
Component ident ification 87 FBWC module LEDs The FBWC module has two single - color LEDs (green and amber) . The LEDs are du plicated on the reverse side of the cache module to fa cilitate status viewin g. 1 Green LED 2 Amber LED Interpretation Off On A backup is in progress.
Component ident ification 88 F an locations P ower su pply backplan e components.
Component ident ification 89 Item Description 1 Graphics c ard power connector 2 Graphics card p ower connector 3 Graphics card p ower connector 4 SAS backplane power conn ector 5 Fan power conne ctor.
Cabling 90 C abling DVD- ROM drive cabling.
Specifications 91 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping - 40 ° C to 70 ° C ( - 40 ° F to 158 ° F) Maximum wet bulb tempera ture 28 ° C (82.
Acronyms and abbreviation s 92 A c r on y ms and abbr e v iati on s ABEND abnormal end ASR Automatic Server R ecovery BBWC battery - backed write c ache FBWC flash - backed write cache iLO 3 Integrate.
Acronyms and abbrevia tions 93 RBSU ROM - Based Setup Utility SAS serial attached SCSI SD Secure Digital SIM Systems In sight Manager SPI system perip heral interfa ce TPM Trusted Platform Modu le UID.
Documentation feedback 94 Doc ument ati on f eedbac k HP is committed to pro viding documentation that mee ts your needs. To help us improve the docume ntation, send any erro rs, suggestion s, or comments to Documentation Feedback ( mailto:docsf eedback@hp.
Index 95 A access panel 28 ASR (Automatic Se rver Recovery) 70 Automatic Server R ecovery (ASR) 70 B backplane, hard drive 65 backplane, powe r 65 backplane, SAS 65 battery 19, 62, 80 battery pack LED.
Index 96 I I/O expansion board compo nents 81 I/O expansion boards, remo ving 50 illustrated parts catalog 16 iLO (Integrated Ligh ts - Ou t) 70 IML (Integrate d Management Log) 69 Insight Diagnosti c.
Index 97 status lights, battery pack 85 support packs 67 switch, system maintenance 78 system battery 80 system board 19, 62, 65 system boar d components 78, 79 system boar d switches 79 system compon.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté HP (Hewlett-Packard) 643064-001 c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du HP (Hewlett-Packard) 643064-001 - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation HP (Hewlett-Packard) 643064-001, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le HP (Hewlett-Packard) 643064-001 va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le HP (Hewlett-Packard) 643064-001, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du HP (Hewlett-Packard) 643064-001.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le HP (Hewlett-Packard) 643064-001. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei HP (Hewlett-Packard) 643064-001 ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
