Manuel d'utilisation / d'entretien du produit Semiconductor du fabricant Toshiba
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[6] Handling Guide 93 [ 6 ] Handling Guide 1. Using T oshiba Semiconductors Safely TOSH IBA is contin ually wo rking to improve t he qu ality and reliabi lity of its produc ts. Neverthe less, semicondu cto r devices in ge neral can mal f unction o r fai l due to their i nherent el ectrical sensitiv ity and vul nerability t o physical stress.
[6] Handling Guide 94 2. Safety Precautions This section lists imp ortant precaut ions whic h users of semiconduct or devic es (and an yone els e) should ob serve in or der t o avoid i njury and damag e to prop erty , and to ensur e safe a nd cor rect use of devices .
[6] Handling Guide 95 2.1 General Precautions reg arding Semiconductor D evices Do not use devices under conditions exceeding t hei r absolut e maxim um ratings (e.
[6] Handling Guide 96 3. General Safety Precautions and Usage Considerations This secti on is designed to help you gain a better understandi ng of semico n ductor devices , so as to ensure the s afety , qualit y and relia bility of the devic es which you inc orporate into your designs.
[6] Handling Guide 97 (e) Make s ure that se ctions of the ta pe carrier wh i ch come i nto contact wi th install a tion device s or other elect rical mach inery are mad e of a l ow-resist ance mat erial. (f) Make sure that jigs and tools used in the assembly process do not touch devic es.
[6] Handling Guide 98 • Whe n storing pri n ted circuit boards wh ich have device s mounted on them, use a board container or bag that is prot ected ag ainst stat ic charge.
[6] Handling Guide 99 3.2 Sto rage 3.2.1 Gen eral Storage • A void storage l o cations wher e device s will b e exposed to moistur e or dir ect sunlig ht • Follow the instructions pri nted on the device cartons regarding transport ation and st orage.
[6] Handling Guide 100 3.3 Design Care must be exer cised in the des i gn of elect ronic e quipm ent to ach ieve t he desir ed rel iability . It is important n ot only to adhere to specif ications c o.
[6] Handling Guide 101 3.3.4 Input processing Inputs to CMO S ICs hav e such a high i m pedance that the log ic level b e comes undef ined under open i nput conditions. S hould t he float ing input be neith er High nor Low , both P-cha nnel and N-c hannel tr ansistors tu rn on, and unnece ssary supply cu rre nt flows.
[6] Handling Guide 102 3.3.7 Effe ct of Slow Rise and Fall Time on Input When a wav eform wit h a slow rise and fall time is applie d to a CMOS input, th e output will sometimes tend to oscillate around V th (the circuit thres hold voltage) of th e input waveform.
[6] Handling Guide 103 3.3.10 Wirin g Precaut ions (1) Output waveform distortion Since the output i mpedanc es of t he Mini- MOS Ser ies are v ery low , distor tion is s ometim es caused in the outp ut wavef orm by the L componen t of th e wiring .
[6] Handling Guide 104 3.3.11 Latch-up CMOS dev ices are subj ect to latch-up , an undes irable co ndit ion in whic h a paras itic P NPN junc tion (thyristo r) in the CMOS I C co nducts. An abnormal current of se veral hundred m A can flow be tween V CC and GND, destroying th e IC.
[6] Handling Guide 105 T able 3.1 T est Resu lt EIAJ Method MIL-STD Method Name Input Output Input Out put TC7MH244FK >± 200 V >± 200 V >± 2000 V >± 2000 V TC7MET244AFK >± 200 V &g.
[6] Handling Guide 106 3.3.13 M eta-St able Characteristi cs When the s etup t ime or hold-t ime of a f lip-fl op is not ad hered to th e device’ s output respons e is uncertain.
[6] Handling Guide 107 3.3.14 T hermal Design The fail ure rate o f semicond ucto r devices is greatl y increased a s operatin g temperatu r e s increa se . As shown in Figure 3.9, the i nternal thermal st ress on a devic e is the sum of the ambient temperature and the t emperatur e rise due to pow er dissip ation in the d e vice.
[6] Handling Guide 108 3.3.16 External No ise Printed circ uit boards w ith long I/O or sign al patt ern lines are vulnerab le to induc ed noise or surg es from outsid e sources. Consequently , malfunctions or breakdowns can r esult from overcur rent or ov ervo ltage, d epending on the t ypes of d evi ce used.
[6] Handling Guide 109 3.3.19 Safety Stan dards Each countr y has safety standar ds which must be obs erved. Thes e safety standards include requirement s for qu ality a ssurance sy stems and design of device insulatio n.
[6] Handling Guide 110 3.4.2 Inspect ion Sequence 1. Do not inser t devic es in the wrong or ientation. Make su re that the positiv e and neg ative el ectrodes of the p ower supply are c orrectly conne cted.
[6] Handling Guide 111 on the internal lea d s. I f the relative di ffere nce is grea t enough, the device’ s interna l leads, adh esive proper ties or s ealant can be damaged.
[6] Handling Guide 112 3.5.3 Solder ing T emp erature Pr ofile The solder ing t emperat ure and heating time var y from d evice t o devic e. Therefor e, when specify ing the mounting conditions, re fer to the individual datasheets and da tabooks for the devices used.
[6] Handling Guide 113 3.5.4 Flux Cleaning and Ultra sonic Cleaning (1) Whe n cleaning ci rcuit boards to re move flux, ma ke sure that no res idual rea cti ve ions such as Na or Cl rema i n. Note that organi c solvents rea ct with water to ge nerate hydro gen chloride a nd other co rrosive ga se s which can degra de device perfo rmance.
[6] Handling Guide 114 3.5.5 No Clean ing If analo g devices or hi gh-speed devices are used wi tho u t being clea n ed, flux residue s may cause minute amounts of leakage between pins.
[6] Handling Guide 115 3.6 Protecting Devices in the Field 3.6.1 T emperat ure Semi co nductor devi ces are gen e rally mo re sensiti ve to temperature than are oth e r electroni c component s. The v arious elect rical char acteristic s of a semiconduc tor devic e are d ependent on the ambient te mperatur e at w hich t he devic e is used .
[6] Handling Guide 116 3.6.6 Interferen ce from L ight (ult raviolet ra ys, sunligh t, fluo rescent lamps and incan descent lamps) Light stri king a semi conductor de vice genera tes electro motive force due to photoelectri c effects. In some ca se s the device can malfuncti on.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté Toshiba Semiconductor c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du Toshiba Semiconductor - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation Toshiba Semiconductor, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le Toshiba Semiconductor va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le Toshiba Semiconductor, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du Toshiba Semiconductor.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le Toshiba Semiconductor. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei Toshiba Semiconductor ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
